Wei; Lingyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wei; Lingyun.The latest application filed is for "liner alloy, steel element and method".

Company Profile

0.3.14

Wei; Lingyun - Mobile AL
Wei; Lingyun - Shrewsbury MA
Wei; Lingyun - Englewood CO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liner alloy, steel element and method Grant 11,401,592 - Wei August 2, 2	2022-08-02
Liner Alloy, Steel Element And Method App 20210310106 - Wei; Lingyun	2021-10-07
Method Of Electroplating Low Internal Stress Copper Deposits On Thin Film Substrates To Inhibit Warping App 20170145577 - Kao; Yu Hua ; et al.	2017-05-25
Acid Copper Electroplating Bath And Method For Electroplating Low Internal Stress And Good Ductility Copper Deposits App 20170067173 - Wei; Lingyun ; et al.	2017-03-09
Acid Copper Electroplating Bath And Method For Electroplating Low Internal Stress And Good Ductiility Copper Deposits App 20160312372 - WEI; Lingyun ; et al.	2016-10-27
Plating Of Copper On Semiconductors App 20140174936 - Hamm; Gary ; et al.	2014-06-26
Method Of Metal Plating Semiconductors App 20140008234 - WEI; Lingyun ; et al.	2014-01-09
Activation Process To Improve Metal Adhesion App 20130203252 - WEI; Lingyun ; et al.	2013-08-08
Methods of treating a surface to promote metal plating and devices formed Grant 8,323,769 - Kuhr , et al. December 4, 2	2012-12-04
Multipodal tethers for high-density attachment of redox-active moieties to substrates Grant 8,173,630 - Lindsey , et al. May 8, 2	2012-05-08
Methods Of Treating A Surface To Promote Metal Plating And Devices Formed App 20100071938 - Kuhr; Werner G. ; et al.	2010-03-25
Methods Of Treating A Surface To Promote Metal Plating And Devices Formed App 20100075427 - Kuhr; Werner G. ; et al.	2010-03-25
Methods of Treating a Surface to Promote Metal Plating and Devices Formed App 20090056994 - Kuhr; Werner G. ; et al.	2009-03-05
Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom App 20090056991 - Kuhr; Werner G. ; et al.	2009-03-05
Multypodal tethers for high-density attachment of redox-active moieties to substrates App 20070108438 - Lindsey; Jonathan S. ; et al.	2007-05-17

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