WEI; KUO-LIANG
Patent Applications and Registrations
Patent applications and USPTO patent grants for WEI; KUO-LIANG.The latest application filed is for "signal processing method and apparatus, controlling apparatus, and controlled apparatus".
- WEI; KUO-LIANG - NEW TAIPEI CITY TW
- Wei; Kuo Liang - Hsinchu County TW
- Wei; Kuo Liang - Hsinchu TW
- Wei; Kuo-Liang - Hsin-Chu TW
- Wei; Kuo-Liang - Sanchung TW
| Patent | Date |
|---|---|
| Signal Processing Method And Apparatus, Controlling Apparatus, And Controlled Apparatus App 20170041142 - HSIEH; KUN-LIANG ; et al. | 2017-02-09 |
| Semiconductor device and method of manufacturing a semiconductor device Grant 8,372,714 - Wei , et al. February 12, 2 | 2013-02-12 |
| Semiconductor Device And Method Of Manufacturing A Semiconductor Device App 20110316096 - Wei; Kuo Liang ; et al. | 2011-12-29 |
| Method for preventing Al-Cu bottom damage using TiN liner Grant 8,076,778 - Wei , et al. December 13, 2 | 2011-12-13 |
| Fabrication of metal film stacks having improved bottom critical dimension Grant 7,960,835 - Hsu , et al. June 14, 2 | 2011-06-14 |
| METHOD FOR PREVENTING Al-Cu BOTTOM DAMAGE USING TiN LINER App 20110074030 - Wei; Kuo Liang ; et al. | 2011-03-31 |
| Fabrication Of Metal Film Stacks Having Improved Bottom Critical Dimension App 20100276807 - Hsu; Han-Hui ; et al. | 2010-11-04 |
| Method of manufacturing spacer Grant 7,648,924 - Wei January 19, 2 | 2010-01-19 |
| Method Of Manufacturing Spacer App 20080242092 - Wei; Kuo-Liang | 2008-10-02 |
| Method of reducing pattern pitch in integrated circuits Grant 7,105,099 - Chung , et al. September 12, 2 | 2006-09-12 |
| [method Of Reducing Pattern Pitch In Integrated Circuits] App 20060011575 - Chung; Henry ; et al. | 2006-01-19 |
| Monitor Grant D487,461 - Sheu , et al. March 9, 2 | 2004-03-09 |
| Holder Grant D486,492 - Sheu , et al. February 10, 2 | 2004-02-10 |
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