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Patent applications and USPTO patent grants for Wei; Hua-Fang.The latest application filed is for "electrostatic discharge (esd) structure and buffer driver structure for providing esd and latchup protection for integrated circuit structures in minimized i/o space".
Patent | Date |
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Electrostatic discharge (ESD) structure and buffer driver structure for providing ESD and latchup protection for integrated circuit structures in minimized I/O space Grant 5,835,986 - Wei , et al. November 10, 1 | 1998-11-10 |
Method for forming minimum area structures for sub-micron CMOS ESD protection in integrated circuit structures without extra implant and mask steps, and articles formed thereby Grant 5,728,612 - Wei , et al. March 17, 1 | 1998-03-17 |
ESD protection for deep submicron CMOS devices with minimum tradeoff for latchup behavior Grant 5,719,733 - Wei , et al. February 17, 1 | 1998-02-17 |
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