WEI; Chien-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for WEI; Chien-Cheng.The latest application filed is for "chip packaging device and method of making the same".

Company Profile

1.4.12

WEI; Chien-Cheng - Taipei City TW
Wei; Chien-Cheng - Taipei TW
Wei; Chien-Cheng - New Taipei TW
Wei; Chien-Cheng - New Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Packaging Device And Method Of Making The Same App 20190305024 - CHIU; Zzu-Chi ; et al.	2019-10-03
Fingerprint sensing device and method for producing the same Grant 9,892,302 - Chang , et al. February 13, 2	2018-02-13
Multilayer circuit board and method for manufacturing the same Grant 9,801,288 - Wei , et al. October 24, 2	2017-10-24
Fingerprint Sensing Device And Method For Producing The Same App 20170083736 - WEI; Chien-Cheng ; et al.	2017-03-23
Fingerprint Sensing Device And Method For Producing The Same App 20170083740 - CHANG; Chia-Shuai ; et al.	2017-03-23
Stress-reduced circuit board and method for forming the same Grant 9,468,091 - Wei , et al. October 11, 2	2016-10-11
Interposer And Method For Producing The Same App 20160247696 - RU; Shao-Pin ; et al.	2016-08-25
Multilayer Circuit Board And Method For Manufacturing The Same App 20150319868 - WEI; Chien-Cheng ; et al.	2015-11-05
Interposer And Method For Producing The Same App 20150292099 - RU; Shao-Pin ; et al.	2015-10-15
Stress-reduced Circuit Board And Method For Forming The Same App 20140110159 - Wei; Chien-Cheng ; et al.	2014-04-24
Ceramic Plate With Reflective Film And Method Of Manufacturing The Same App 20120171510 - CHIANG; Ta-Hsiang ; et al.	2012-07-05
Low profile optoelectronic device package App 20110057216 - Chiu; Ming-Kuen ; et al.	2011-03-10
Manufacturing Method Of High-linearity And High-power Cmos Structure App 20080318372 - Chiu; Hsien-Chin ; et al.	2008-12-25
High-linearity and high-power CMOS structure and manufacturing method for the same App 20080157210 - Chiu; Hsien-Chin ; et al.	2008-07-03

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