loadpatents
Patent applications and USPTO patent grants for WEI; Chien-Cheng.The latest application filed is for "chip packaging device and method of making the same".
Patent | Date |
---|---|
Chip Packaging Device And Method Of Making The Same App 20190305024 - CHIU; Zzu-Chi ;   et al. | 2019-10-03 |
Fingerprint sensing device and method for producing the same Grant 9,892,302 - Chang , et al. February 13, 2 | 2018-02-13 |
Multilayer circuit board and method for manufacturing the same Grant 9,801,288 - Wei , et al. October 24, 2 | 2017-10-24 |
Fingerprint Sensing Device And Method For Producing The Same App 20170083736 - WEI; Chien-Cheng ;   et al. | 2017-03-23 |
Fingerprint Sensing Device And Method For Producing The Same App 20170083740 - CHANG; Chia-Shuai ;   et al. | 2017-03-23 |
Stress-reduced circuit board and method for forming the same Grant 9,468,091 - Wei , et al. October 11, 2 | 2016-10-11 |
Interposer And Method For Producing The Same App 20160247696 - RU; Shao-Pin ;   et al. | 2016-08-25 |
Multilayer Circuit Board And Method For Manufacturing The Same App 20150319868 - WEI; Chien-Cheng ;   et al. | 2015-11-05 |
Interposer And Method For Producing The Same App 20150292099 - RU; Shao-Pin ;   et al. | 2015-10-15 |
Stress-reduced Circuit Board And Method For Forming The Same App 20140110159 - Wei; Chien-Cheng ;   et al. | 2014-04-24 |
Ceramic Plate With Reflective Film And Method Of Manufacturing The Same App 20120171510 - CHIANG; Ta-Hsiang ;   et al. | 2012-07-05 |
Low profile optoelectronic device package App 20110057216 - Chiu; Ming-Kuen ;   et al. | 2011-03-10 |
Manufacturing Method Of High-linearity And High-power Cmos Structure App 20080318372 - Chiu; Hsien-Chin ;   et al. | 2008-12-25 |
High-linearity and high-power CMOS structure and manufacturing method for the same App 20080157210 - Chiu; Hsien-Chin ;   et al. | 2008-07-03 |
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