Wei; Cheng-Hong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wei; Cheng-Hong.The latest application filed is for "semiconductor structure and manufacuring method thereof".
- Wei; Cheng-Hong - Taichung City TW
- Wei; Cheng-Hong - Taichung TW
| Patent | Date |
|---|---|
| Semiconductor Structure And Manufacuring Method Thereof App 20220302254 - Pan; Tseng-Yao ; et al. | 2022-09-22 |
| Semiconductor Structures And Methods For Forming The Same App 20210398858 - PAN; Tseng-Yao ; et al. | 2021-12-23 |
| Memory Device App 20210273064 - Wei; Cheng-Hong ; et al. | 2021-09-02 |
| Method of manufacturing a memory device Grant 11,056,564 - Wei , et al. July 6, 2 | 2021-07-06 |
| Resistive Random Access Memory And Manufacturing Method Thereof App 20210159406 - WEI; Cheng-Hong ; et al. | 2021-05-27 |
| Manufacturing method of semiconductor chip Grant 10,957,594 - Wei , et al. March 23, 2 | 2021-03-23 |
| Memory Device And Method Of Manufacturing The Same App 20200203492 - Wei; Cheng-Hong ; et al. | 2020-06-25 |
| Method of wafer dicing and die Grant 10,685,883 - Wei , et al. | 2020-06-16 |
| Manufacturing Method Of Semiconductor Chip App 20200111707 - Wei; Cheng-Hong ; et al. | 2020-04-09 |
| Method of wafer dicing Grant 10,515,853 - Chen , et al. Dec | 2019-12-24 |
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