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Patent applications and USPTO patent grants for Wei; Bor-Jou.The latest application filed is for "metal capping layer for interconnect applications".
Patent | Date |
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Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects Grant 8,848,374 - Lin , et al. September 30, 2 | 2014-09-30 |
Metal Capping Layer for Interconnect Applications App 20140264872 - Lin; Yu-Hung ;   et al. | 2014-09-18 |
Method And Structure For Dissipating Heat Away From A Resistor Having Neighboring Devices And Interconnects App 20120002375 - LIN; Jian-Hong ;   et al. | 2012-01-05 |
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