Wee; Young-jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wee; Young-jin.The latest application filed is for "semiconductor device and method of forming wires of semiconductor device".

Company Profile

0.9.8

Wee; Young-jin - Seongnam-si KR
Wee; Young-Jin - Kyunggi-do KR
Wee; Young-jin - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming wires of semiconductor device Grant 7,638,423 - Lee , et al. December 29, 2	2009-12-29
Method for forming interconnection line in semiconductor device and interconnection line structure Grant 7,635,645 - Lee , et al. December 22, 2	2009-12-22
Semiconductor device and method of manufacturing the same Grant 7,341,908 - Suh , et al. March 11, 2	2008-03-11
Semiconductor device and method of forming wires of semiconductor device App 20070224855 - Lee; Jung-eun ; et al.	2007-09-27
Method of forming interconnection lines for semiconductor device Grant 7,192,864 - Lee , et al. March 20, 2	2007-03-20
Semiconductor device and method of manufacturing the same App 20060170103 - Suh; Bong-seok ; et al.	2006-08-03
Method of forming interconnection lines for semiconductor device App 20050176236 - Lee, Kyoung-Woo ; et al.	2005-08-11
Method for forming interconnection line in semiconductor device and interconnection line structure App 20050161821 - Lee, Kyoung-Woo ; et al.	2005-07-28
Apparatus for testing reliability of interconnection in integrated circuit Grant 6,842,028 - Song , et al. January 11, 2	2005-01-11
Apparatus for testing reliability of interconnection in integrated circuit App 20040189338 - Song, Won-Sang ; et al.	2004-09-30
Apparatus for testing reliability of interconnection in integrated circuit Grant 6,693,446 - Song , et al. February 17, 2	2004-02-17
Apparatus for testing reliability of interconnection in integrated circuit Grant 6,690,187 - Song , et al. February 10, 2	2004-02-10
Apparatus for testing reliability of interconnection in integrated circuit App 20030020507 - Song, Won-Sang ; et al.	2003-01-30
Apparatus for testing reliability of interconnection in integrated circuit App 20030020497 - Song, Won-Sang ; et al.	2003-01-30
Semiconductor device having improved metal line structure and manufacturing method therefor Grant 6,333,260 - Kwon , et al. December 25, 2	2001-12-25
Semiconductor device having improved metal line structure and manufacturing method therefor App 20010006255 - Kwon, Dong-chul ; et al.	2001-07-05
Low resistance interconnect for a semiconductor device and method of fabricating the same Grant 6,249,056 - Kwon , et al. June 19, 2	2001-06-19

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