Weber; Patrick O.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weber; Patrick O..The latest application filed is for "light-emitting pixel array package and method of manufacturing the same".

Company Profile

0.13.5

Weber; Patrick O. - Santa Clara CA
Weber; Patrick O. - Mountain View CA
Weber; Patrick O. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-Emitting Pixel Array Package And Method of Manufacturing The Same App 20100014234 - Weber; Patrick O.	2010-01-21
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC Grant 7,049,166 - Salatino , et al. May 23, 2	2006-05-23
Integrated circuit package including opening exposing portion of an IC Grant 6,667,439 - Salatino , et al. December 23, 2	2003-12-23
Method of underfilling an integrated circuit chip Grant 6,495,083 - Weber December 17, 2	2002-12-17
Integrated circuit package including opening exposing portion of an IC App 20020088632 - Salatino, Matthew M. ; et al.	2002-07-11
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC App 20020081780 - Salatino, Matthew M. ; et al.	2002-06-27
Chip package with molded underfill App 20020043721 - Weber, Patrick O.	2002-04-18
Chip package with molded underfill Grant 6,324,069 - Weber November 27, 2	2001-11-27
Method Of Underfilling An Integrated Circuit Chip App 20010038166 - WEBER, PATRICK O.	2001-11-08
Chip package with transfer mold underfill Grant 6,157,086 - Weber December 5, 2	2000-12-05
Chip package with molded underfill Grant 6,038,136 - Weber March 14, 2	2000-03-14
Semiconductor non-laminate package and method Grant 5,929,522 - Weber July 27, 1	1999-07-27
Methods of making multi-tier laminate substrates for electronic device packaging Grant 5,798,014 - Weber August 25, 1	1998-08-25
Apparatus for encapsulating electronic packages Grant 5,776,512 - Weber July 7, 1	1998-07-07
Transfer modlded electronic package having a passage means Grant 5,652,463 - Weber , et al. July 29, 1	1997-07-29
Methods of making multi-tier laminate substrates for electronic device packaging Grant 5,622,588 - Weber April 22, 1	1997-04-22
Apparatus for encapsulating electronic packages Grant 5,609,889 - Weber March 11, 1	1997-03-11
Multi-tier laminate substrate with internal heat spreader Grant 5,597,643 - Weber January 28, 1	1997-01-28

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