Weber; Heribert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weber; Heribert.The latest application filed is for "roller groups for grinding devices, grinding devices, and methods".

Company Profile

2.95.107

Weber; Heribert - Nuertingen DE
WEBER; Heribert - Arbon CH
Weber; Heribert - Neurtingen N/A DE
Weber; Heribert - Hattingen DE
Weber; Heribert - Nuetingen DE
Weber; Heribert - Nurtingen DE
Weber; Heribert - Kirchheim/Teck DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micromechanical component for a sensor device or microphone device Grant 11,418,885 - Weber , et al. August 16, 2	2022-08-16
Bonding pad layer system, gas sensor and method for manufacturing a gas sensor Grant 11,407,635 - Scheurle , et al. August 9, 2	2022-08-09
Roller Groups For Grinding Devices, Grinding Devices, And Methods App 20220184628 - HOLENSTEIN; Philippe ; et al.	2022-06-16
Roller Groups For Grinding Devices, Grinding Devices, And Methods App 20220184627 - HOLENSTEIN; Philippe ; et al.	2022-06-16
Sensor Device And Method For Producing A Sensor Device App 20220090975 - Weber; Heribert ; et al.	2022-03-24
Production Method For A Micromechanical Component App 20220081285 - Weber; Heribert ; et al.	2022-03-17
Roller groups for grinding devices, grinding devices, and methods Grant 11,266,993 - Holenstein , et al. March 8, 2	2022-03-08
Micromechanical Component For A Capacitive Pressure Sensor Device App 20220003621 - Friedrich; Thomas ; et al.	2022-01-06
Method For Sealing Entries In A Mems Element App 20220002147 - Hermes; Christoph ; et al.	2022-01-06
Micromechanical Component And Method For Manufacturing A Micromechanical Component App 20210395074 - Artmann; Hans ; et al.	2021-12-23
Micromechanical Component For A Sensor Or Microphone Device App 20210354978 - Weber; Heribert ; et al.	2021-11-18
Roller Groups For Grinding Devices, Grinding Devices, And Methods App 20210245167 - HOLENSTEIN; Philippe ; et al.	2021-08-12
Micromechanical Component For A Sensor Device Or Microphone Device App 20210219058 - Weber; Heribert ; et al.	2021-07-15
Micromechanical Pressure Sensor Device And Corresponding Manufacturing Method App 20210215559 - Weber; Heribert ; et al.	2021-07-15
Micromechanical Component For A Capacitive Pressure Sensor Device App 20200200631 - Friedrich; Thomas ; et al.	2020-06-25
Bonding Pad Layer System, Gas Sensor And Method For Manufacturing A Gas Sensor App 20200140261 - Scheurle; Andreas ; et al.	2020-05-07
Magnetically drivable micromirror Grant 9,791,663 - Pinter , et al. October 17, 2	2017-10-17
Method For The Micro-structured Application Of A Fluid Or Paste Onto A Surface App 20170165711 - Weber; Heribert ; et al.	2017-06-15
Micromechanical component and method for producing a micromechanical component Grant 9,593,011 - Gonska , et al. March 14, 2	2017-03-14
Micromechanical component Grant 9,567,212 - Gonska , et al. February 14, 2	2017-02-14
Micromechanical component for a capacitive sensor device, and manufacturing method for a micromechanical component for a capacitive sensor device Grant 9,518,877 - Weber December 13, 2	2016-12-13
Device For Treating And/or Processing Bulk Material App 20160281906 - SIGNER; Walter ; et al.	2016-09-29
Component in the form of a wafer level package and method for manufacturing same Grant 9,406,747 - Weber , et al. August 2, 2	2016-08-02
Method for manufacturing a micromechanical component Grant 9,365,417 - Mayer , et al. June 14, 2	2016-06-14
Dispersion for the metallization of contactings Grant 9,324,474 - Weber , et al. April 26, 2	2016-04-26
Hybrid integrated component Grant 9,266,720 - Classen , et al. February 23, 2	2016-02-23
Hybridly integrated component and method for the production thereof Grant 9,212,048 - Classen , et al. December 15, 2	2015-12-15
ASIC element including a via Grant 9,153,523 - Weber , et al. October 6, 2	2015-10-06
Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates Grant 9,123,716 - Gonska , et al. September 1, 2	2015-09-01
Method for manufacturing a hybrid integrated component Grant 9,067,778 - Classen , et al. June 30, 2	2015-06-30
dispersion for the metallization of contactings App 20150151328 - WEBER; Heribert ; et al.	2015-06-04
Method for producing a metal structure in a semiconductor substrate Grant 9,048,247 - Weber June 2, 2	2015-06-02
Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap Grant 9,040,336 - Classen , et al. May 26, 2	2015-05-26
Component Having A Via And Method For Manufacturing It App 20150137329 - Gonska; Julian ; et al.	2015-05-21
Component having through-hole plating, and method for its production Grant 9,035,432 - Reinmuth , et al. May 19, 2	2015-05-19
Method for constructing an electrical circuit, and electrical circuit Grant 8,993,356 - Pirk , et al. March 31, 2	2015-03-31
Component having a via and method for manufacturing it Grant 8,975,118 - Gonska , et al. March 10, 2	2015-03-10
Micromechanical component for a capacitive sensor device, and manufacturing method for a micromechanical component for a capacitive sensor device App 20150061049 - WEBER; Heribert	2015-03-05
Component In The Form Of A Wafer Level Package And Method For Manufacturing Same App 20140374917 - WEBER; Heribert ; et al.	2014-12-25
Component Including Means For Reducing Assembly-related Mechanical Stresses And Methods For Manufacturing Same App 20140374853 - WEBER; Heribert ; et al.	2014-12-25
Method For Producing A Metal Structure In A Semiconductor Substrate App 20140377933 - WEBER; Heribert	2014-12-25
Asic Element Including A Via App 20140374918 - WEBER; Heribert ; et al.	2014-12-25
Micromechanical component having an inclined structure and corresponding manufacturing method Grant 8,847,336 - Pirk , et al. September 30, 2	2014-09-30
Hybrid integrated component and method for the manufacture thereof Grant 8,836,053 - Weber , et al. September 16, 2	2014-09-16
Hybrid integrated component and method for the manufacture thereof Grant 8,823,116 - Weber September 2, 2	2014-09-02
Hybrid integrated pressure sensor component Grant 8,779,536 - Weber July 15, 2	2014-07-15
Method for producing a semiconductor component and a semiconductor component produced according to the method Grant RE44,995 - Benzel , et al. July 8, 2	2014-07-08
Method for creating monocrystalline piezoresistors Grant 8,759,136 - Benzel , et al. June 24, 2	2014-06-24
Sensor module Grant 8,748,998 - Frey , et al. June 10, 2	2014-06-10
Micromechanical Component App 20140117472 - Gonska; Julian ; et al.	2014-05-01
Hybrid Integrated Component App 20140117475 - CLASSEN; Johannes ; et al.	2014-05-01
Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap App 20140110800 - CLASSEN; Johannes ; et al.	2014-04-24
Hybrid Integrated Pressure Sensor Component App 20140091405 - WEBER; Heribert	2014-04-03
Magnetically Drivable Micromirror App 20140092458 - Pinter; Stefan ; et al.	2014-04-03
Method for forming trenches in a semiconductor component Grant 8,679,975 - Reinmuth , et al. March 25, 2	2014-03-25
Method for manufacturing a micromechanical structure, and micromechanical structure Grant 8,659,099 - Reinmuth , et al. February 25, 2	2014-02-25
Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Grant 8,647,961 - Frey , et al. February 11, 2	2014-02-11
Component Having Through-hole Plating, And Method For Its Production App 20130341766 - REINMUTH; Jochen ; et al.	2013-12-26
Hybrid Integrated Component And Method For The Manufacture Thereof App 20130334626 - WEBER; Heribert	2013-12-19
Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas Grant 8,607,447 - Reinmuth , et al. December 17, 2	2013-12-17
Hybrid Integrated Component And Method For The Manufacture Thereof App 20130299924 - WEBER; Heribert ; et al.	2013-11-14
Hybridly Integrated Component And Method For The Production Thereof App 20130299928 - CLASSEN; Johannes ; et al.	2013-11-14
Method For Manufacturing A Hybrid Integrated Component App 20130285165 - CLASSEN; Johannes ; et al.	2013-10-31
Method for producing a micromechanical component having a trench structure for backside contact Grant 8,564,078 - Scheuerer , et al. October 22, 2	2013-10-22
Micromechanical component and corresponding production method Grant 8,558,327 - Knese , et al. October 15, 2	2013-10-15
Method for attaching a first carrier device to a second carrier device and micromechanical components Grant 8,530,260 - Gonska , et al. September 10, 2	2013-09-10
Component Having A Through-connection App 20130209672 - REINMUTH; Jochen ; et al.	2013-08-15
Sensor system, method for operating a sensor system, and method for manufacturing a sensor system Grant 8,485,041 - Ahles , et al. July 16, 2	2013-07-16
Method For Bonding Two Silicon Substrates, And A Correspondeing System Of Two Silicon Substrates App 20130161820 - GONSKA; Julian ; et al.	2013-06-27
Component Having a Via and Method for Manufacturing It App 20130147020 - Gonska; Julian ; et al.	2013-06-13
Method for producing a micromechanical component having a filler layer and a masking layer Grant 8,419,957 - Scheuerer , et al. April 16, 2	2013-04-16
Method For Manufacturing A Micromechanical Structure, And Micromechanical Structure App 20130043548 - Reinmuth; Jochen ; et al.	2013-02-21
Device made of single-crystal silicon Grant 8,298,962 - Kaelberer , et al. October 30, 2	2012-10-30
Method for creating monocrystalline piezoresistors App 20120248552 - BENZEL; Hubert ; et al.	2012-10-04
Method for producing a micromechanical component and mircomechanical component Grant 8,207,585 - Schlosser , et al. June 26, 2	2012-06-26
Capacitive acceleration sensor having a movable mass and a spring element Grant 8,181,522 - Scheuerer , et al. May 22, 2	2012-05-22
Method for producing a micromechanical component having a trench structure for backside contact Grant 8,138,006 - Scheuerer , et al. March 20, 2	2012-03-20
Method for Constructing an Electrical Circuit, and Electrical Circuit App 20120061860 - Pirk; Tjalf ; et al.	2012-03-15
Method For Producing A Micromechanical Component Having A Trench Structure For Backside Contact App 20120049301 - Scheuerer; Roland ; et al.	2012-03-01
Method for producing a semiconductor component and a semiconductor component produced according to the method Grant 8,123,963 - Benzel , et al. February 28, 2	2012-02-28
Micromechanical Component And Method For Producing A Micromechanical Component App 20120045628 - Gonska; Julian ; et al.	2012-02-23
Method For Filling Cavities In Wafers, Correspondingly Filled Blind Hole And Wafer Having Correspondingly Filled Insulation Trenches App 20120038030 - Frey; Jens ; et al.	2012-02-16
Method for Producing an Electrical Circuit and Electrical Circuit App 20120038065 - Butz; Juergen ; et al.	2012-02-16
Sensor Module App 20120032283 - FREY; Jens ; et al.	2012-02-09
Sensor System, Method For Operating A Sensor System, And Method For Manufacturing A Sensor System App 20110259109 - Ahles; Marcus ; et al.	2011-10-27
Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas App 20110169169 - REINMUTH; JOCHEN ; et al.	2011-07-14
Method For Forming Trenches In A Semiconductor Component App 20110169125 - REINMUTH; Jochen ; et al.	2011-07-14
Arrangement For Recooling Cooling Water App 20110011566 - Gnegel; Joachim ; et al.	2011-01-20
Device Made Of Single-crystal Silicon App 20110014794 - KAELBERER; Arnd ; et al.	2011-01-20
Micromechanical diaphragm sensor having a double diaphragm Grant 7,863,072 - Illing , et al. January 4, 2	2011-01-04
Micromechanical Acceleration Sensor And Method For Manufacturing An Acceleration Sensor App 20100307247 - Weber; Heribert	2010-12-09
Device made of single-crystal silicon Grant 7,834,452 - Kaelberer , et al. November 16, 2	2010-11-16
Micromechanical component and corresponding production method Grant 7,833,405 - Benzel , et al. November 16, 2	2010-11-16
Method for attaching a first carrier device to a second carrier device and micromechanical components App 20100258884 - Gonska; Julian ; et al.	2010-10-14
Micromechanical Component And Corresponding Production Method App 20100164023 - Knese; Kathrin ; et al.	2010-07-01
Method For Producing A Micromechanical Component Having A Trench Structure For Backside Contact App 20100133630 - Scheuerer; Roland ; et al.	2010-06-03
Micromechanical component and method for producing a micromechanical component Grant 7,705,413 - Weber , et al. April 27, 2	2010-04-27
Method For Producing A Micromechanical Component Having A Filler Layer And A Masking Layer App 20100089868 - Scheuerer; Roland ; et al.	2010-04-15
Method for manufacturing a semiconductor component and a semiconductor component, in particular a diaphragm sensor Grant 7,679,154 - Benzel , et al. March 16, 2	2010-03-16
Method for Manufacturing a Diaphragm on a Semiconductor Substrate and Micromechanical Component Having Such a Diaphragm App 20100025786 - Schmollngruber; Peter ; et al.	2010-02-04
Micromechanical diaphragm sensor having a double diaphragm App 20090206422 - Illing; Matthias ; et al.	2009-08-20
Method For Producing A Micromechanical Component And Mircomechanical Component App 20090162619 - Schlosser; Roman ; et al.	2009-06-25
Acceleration Sensor App 20090100932 - SCHEUERER; Roland ; et al.	2009-04-23
Micromechanical component and method for producing a micromechanical component App 20090079037 - Weber; Heribert ; et al.	2009-03-26
Method for producing a semiconductor component and a semiconductor component produced according to the method Grant 7,479,232 - Benzel , et al. January 20, 2	2009-01-20
Method for producing cavities having optically transparent wall Grant 7,479,234 - Benzel , et al. January 20, 2	2009-01-20
Device made of single-crystal silicon App 20090008749 - Kaelberer; Arnd ; et al.	2009-01-08
Method for producing a semiconductor component and a semiconductor component produced according to the method App 20080286970 - Benzel; Hubert ; et al.	2008-11-20
Microstructured chemical sensor Grant 7,453,254 - Weber , et al. November 18, 2	2008-11-18
Micromechanical component and suitable method for its manufacture Grant 7,435,691 - Weber October 14, 2	2008-10-14
Method for manufacturing a semcoductor component and a semiconductor component, in particular a diaphragm sensor App 20080093694 - Benzel; Hubert ; et al.	2008-04-24
Pressure sensor featuring pressure loading of the fastening element Grant 7,343,806 - Muchow , et al. March 18, 2	2008-03-18
Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor Grant 7,306,966 - Benzel , et al. December 11, 2	2007-12-11
Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method Grant 7,300,854 - Benzel , et al. November 27, 2	2007-11-27
Microstructured Chemical Sensor App 20070234801 - Weber; Heribert ; et al.	2007-10-11
Membrane sensor Grant 7,279,759 - Muller-Fiedler , et al. October 9, 2	2007-10-09
Micromechanical component and corresponding manufacturing method App 20070222006 - Weber; Heribert ; et al.	2007-09-27
Gas sensor and method for the production thereof App 20070062812 - Weber; Heribert ; et al.	2007-03-22
Semiconductor component and a method for producing the same Grant 7,193,290 - Benzel , et al. March 20, 2	2007-03-20
Method of producing a semiconductor sensor component Grant 7,160,750 - Benzel , et al. January 9, 2	2007-01-09
Micromechanical structural element having a diaphragm and method for producing such a structural element Grant 7,148,077 - Fuertsch , et al. December 12, 2	2006-12-12
Membrane sensor App 20060197634 - Muller-Fiedler; Roland ; et al.	2006-09-07
Pressure sensor featuring pressure loading of the fastening element App 20060162462 - Muchow; Joerg ; et al.	2006-07-27
Method for producing micromechanic sensors and sensors produced by said method Grant 7,045,382 - Benzel , et al. May 16, 2	2006-05-16
Method for production of a semiconductor component and a semiconductor component produced by said method Grant 7,037,438 - Benzel , et al. May 2, 2	2006-05-02
Micromechanical component and suitable method for its manufacture App 20060057755 - Weber; Heribert	2006-03-16
Method and micromechanical component App 20060037932 - Lammel; Gerhard ; et al.	2006-02-23
Method for producing a semiconductor component and a semiconductor component produced according to the method App 20060014392 - Benzel; Hubert ; et al.	2006-01-19
Sensor assembly for measuring a gas concentration App 20050199041 - Weber, Heribert ; et al.	2005-09-15
Micromechanical component Grant 6,906,392 - Benzel , et al. June 14, 2	2005-06-14
Micromechanical structural element having a diaphragm and method for producing such a structural element App 20050098840 - Fuertsch, Matthias ; et al.	2005-05-12
Method for producing cavities having optically transparent wall App 20050016949 - Benzel, Hubert ; et al.	2005-01-27
Semiconductor element and method for its production App 20050020007 - Weber, Heribert ; et al.	2005-01-27
Sensor element App 20050006235 - Fuertsch, Matthias ; et al.	2005-01-13
Micromechanical component and pressure sensor having a component of this type Grant 6,840,111 - Benzel , et al. January 11, 2	2005-01-11
Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor App 20040266050 - Benzel, Hubert ; et al.	2004-12-30
Flow sensor having two heating resistors App 20040261521 - Hecht, Hans ; et al.	2004-12-30
Micromechanical component and manufacturing method Grant 6,832,523 - Benzel , et al. December 21, 2	2004-12-21
Mass flow sensor having an improved membrane stability Grant 6,820,481 - Weber , et al. November 23, 2	2004-11-23
Micromechanical component with different doping types so that one type is anodized into porous silicon Grant 6,803,637 - Benzel , et al. October 12, 2	2004-10-12
Method for producing optically transparent regions in a silicon substrate App 20040155010 - Benzel, Hubert ; et al.	2004-08-12
Semicoductor component and a method for producing the same App 20040155751 - Benzel, Hubert ; et al.	2004-08-12
Method for producing micromechanic sensors and sensors produced by said method App 20040152228 - Benzel, Hubert ; et al.	2004-08-05
Method for producing a semiconductor component and a semiconductor component produced according to this method App 20040147057 - Benzel, Hubert ; et al.	2004-07-29
Micromechanical component (on pressure sensor membrane) comprising a bellowstype structure for temperature shifts App 20040089073 - Benzel, Hubert ; et al.	2004-05-13
Micromechanical component and corresponding production method App 20040080004 - Benzel, Hubert ; et al.	2004-04-29
Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method App 20040065931 - Benzel, Hubert ; et al.	2004-04-08
Micromechanical component App 20040021184 - Benzel, Hubert ; et al.	2004-02-05
Micromechanical component and corresponing production method App 20030116813 - Benzel, Hubert ; et al.	2003-06-26
Micromechanical component App 20020174724 - Benzel, Hubert ; et al.	2002-11-28
Method for production of a semiconductor component and a semiconductor component produced by said method App 20020170875 - Benzel, Hubert ; et al.	2002-11-21
Micromechanical component and manufacturing method App 20020139171 - Benzel, Hubert ; et al.	2002-10-03
Device for measuring the mass of a medium flowing in a line Grant 6,336,360 - Weber January 8, 2	2002-01-08
Conductor path contacting arrangement and method Grant 6,303,990 - Weber October 16, 2	2001-10-16
Sensor having a membrane Grant 6,240,777 - Treutler , et al. June 5, 2	2001-06-05
Micromechanical acceleration sensor Grant 5,905,203 - Flach , et al. May 18, 1	1999-05-18