Webb; Eric G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Webb; Eric G..The latest application filed is for "wet etching methods for copper removal and planarization in semiconductor processing".

Company Profile

0.20.8

Webb; Eric G. - Camas OR
Webb; Eric G. - Tigard OR
Webb; Eric G. - West Linn OR
Webb; Eric G. - Salem OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wet etching methods for copper removal and planarization in semiconductor processing Grant 9,447,505 - Mayer , et al. September 20, 2	2016-09-20
Wet Etching Methods For Copper Removal And Planarization In Semiconductor Processing App 20150267306 - Mayer; Steven T. ; et al.	2015-09-24
Photoresist-free Metal Deposition App 20140014522 - Mayer; Steven T. ; et al.	2014-01-16
Photoresist-free metal deposition Grant 8,500,985 - Mayer , et al. August 6, 2	2013-08-06
Topography reduction and control by selective accelerator removal Grant 8,470,191 - Mayer , et al. June 25, 2	2013-06-25
Capping before barrier-removal IC fabrication method Grant 8,415,261 - Reid , et al. April 9, 2	2013-04-09
Electroless plating-liquid system Grant 8,257,781 - Webb , et al. September 4, 2	2012-09-04
Topography reduction and control by selective accelerator removal Grant 8,158,532 - Mayer , et al. April 17, 2	2012-04-17
Capping before barrier-removal IC fabrication method Grant 8,043,958 - Reid , et al. October 25, 2	2011-10-25
Photoresist-free metal deposition Grant 7,947,163 - Mayer , et al. May 24, 2	2011-05-24
Electroless layer plating process and apparatus Grant 7,897,198 - Park , et al. March 1, 2	2011-03-01
Capping before barrier-removal IC fabrication method Grant 7,811,925 - Reid , et al. October 12, 2	2010-10-12
Small-volume electroless plating cell Grant 7,690,324 - Feng , et al. April 6, 2	2010-04-06
Photoresist-free metal deposition App 20090280243 - Mayer; Steven T. ; et al.	2009-11-12
Topography reduction and control by selective accelerator removal App 20090280649 - Mayer; Steven T. ; et al.	2009-11-12
Topography reduction and control by selective accelerator removal App 20090277867 - Mayer; Steven T. ; et al.	2009-11-12
Photoresist-free metal deposition App 20090277801 - Mayer; Steven T. ; et al.	2009-11-12
Capping before barrier-removal IC fabrication method Grant 7,605,082 - Reid , et al. October 20, 2	2009-10-20
Anneal of ruthenium seed layer to improve copper plating Grant 7,442,267 - Webb , et al. October 28, 2	2008-10-28
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Grant 7,341,946 - Kailasam , et al. March 11, 2	2008-03-11
Electroplating bath containing wetting agent for defect reduction Grant 7,232,513 - Webb , et al. June 19, 2	2007-06-19
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece App 20050098440 - Kailasam, Sridhar K. ; et al.	2005-05-12
Electroplating using DC current interruption and variable rotation rate Grant 6,884,335 - Webb , et al. April 26, 2	2005-04-26
Electroplating using DC current interruption and variable rotation rate App 20040231996 - Webb, Eric G. ; et al.	2004-11-25
Electroless copper deposition method for preparing copper seed layers Grant 6,664,122 - Andryuschenko , et al. December 16, 2	2003-12-16

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