WAVENICS, INC

Patent Applications and Registrations

Patent applications and USPTO patent grants for WAVENICS, INC.The latest application filed is for "light emitting device package and manufacturing method thereof".

Company Profile

2.6.11

WAVENICS, INC - Ansan-si KR
Wavenics Inc. - Daejeon KR
Wavenics Inc. - Daejeon-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light Emitting Device Package And Manufacturing Method Thereof App 20150194585 - KIM; Kyoungmin ; et al.	2015-07-09
Terminal-integrated metal base package module and terminal-integrated metal base packaging method Grant 8,664,538 - Kim March 4, 2	2014-03-04
Package module structure for high power device with metal substrate and method of manufacturing the same Grant 8,497,586 - Kim , et al. July 30, 2	2013-07-30
Terminal-integrated Metal Base Package Module And Terminal-integrated Metal Base Packaging Method App 20130037309 - Kim; Kyoung-Min	2013-02-14
Package Module Structure For High Power Device With Metal Substrate And Method Of Manufacturing The Same App 20130020726 - Kim; Kyoung-Min ; et al.	2013-01-24
Method Of Manufacturing Metal Base Package With Via App 20120103475 - Kim; Kyoung-Min	2012-05-03
Metal-based photonic device package module Grant 8,120,045 - Kwon , et al. February 21, 2	2012-02-21
Method of fabricating passive device applied to the three-dimensional package module Grant 8,034,664 - Kwon , et al. October 11, 2	2011-10-11
Three-dimensional Package Module, Method Of Fabricating The Same, And Method Of Fabricating Passive Device Applied To The Three-dimensional Package Module App 20110037164 - KWON; Young-Se ; et al.	2011-02-17
High Efficiency Led With Multi-layer Reflector Structure And Method For Fabricating The Same App 20110033962 - Kwon; Young-Se ; et al.	2011-02-10
Methal-based Package Substrate, Three-dimensional Multi-layered Package Module Using The Same, And Manufacturing Method Thereof App 20100326707 - Kwon; Young-Se ; et al.	2010-12-30
Three-dimensional package module Grant 7,851,918 - Kwon , et al. December 14, 2	2010-12-14
Method for manufacturing passive device and semiconductor package using thin metal piece Grant 7,838,380 - Kwon , et al. November 23, 2	2010-11-23
Metal-based Photonic Device Package Module And Manufacturing Method Thereof App 20100133557 - Kwon; Young-Se ; et al.	2010-06-03
Multi-layer Package Structure And Fabrication Method Thereof App 20090175022 - Kwon; Young-Se ; et al.	2009-07-09
High Efficiency Led With Multi-layer Reflector Structure And Method For Fabricating The Same App 20090146168 - Kwon; Young-Se ; et al.	2009-06-11
Three-dimensional Package Module, Method Of Fabricating The Same, And Method Of Fabricating Passive Device Applied To The Three-dimensional Package Module App 20090032914 - Kwon; Young-Se ; et al.	2009-02-05

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