Watwe; Abhay A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watwe; Abhay A..The latest application filed is for "electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat".

Company Profile

0.8.11

Watwe; Abhay A. - Chandler AZ
Watwe, Abhay A. - Chadler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 7,432,532 - Chrysler , et al. October 7, 2	2008-10-07
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 7,170,098 - Chrysler , et al. January 30, 2	2007-01-30
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20060270135 - Chrysler; Gregory M. ; et al.	2006-11-30
Electronic assembly with high capacity thermal interface and methods of manufacture Grant 7,098,079 - Chrysler , et al. August 29, 2	2006-08-29
Semiconductor package integral heat spreader App 20060170094 - Subramanian; Sankara J. ; et al.	2006-08-03
Method of providing a heat spreader App 20060127672 - Chrysler; Gregory M. ; et al.	2006-06-15
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 6,921,706 - Chrysler , et al. July 26, 2	2005-07-26
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20050130362 - Chrysler, Gregory M. ; et al.	2005-06-16
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20040157386 - Chrysler, Gregory M. ; et al.	2004-08-12
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 6,770,966 - Chrysler , et al. August 3, 2	2004-08-03
Electronic assembly with high capacity thermal interface and methods of manufacture App 20040082188 - Chrysler, Gregory M. ; et al.	2004-04-29
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Grant 6,661,660 - Prasher , et al. December 9, 2	2003-12-09
Electronic assembly with high capacity thermal interface Grant 6,653,730 - Chrysler , et al. November 25, 2	2003-11-25
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Grant 6,639,799 - Prasher , et al. October 28, 2	2003-10-28
Diamond integrated heat spreader and method of manufacturing same App 20030152773 - Chrysler, Gregory M. ; et al.	2003-08-14
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20030025198 - Chrysler, Gregory M. ; et al.	2003-02-06
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment App 20020080584 - Prasher, Ravi ; et al.	2002-06-27
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment App 20020080583 - Prasher, Ravi ; et al.	2002-06-27
Electronic assembly with high capacity thermal interface and methods of manufacture App 20020074649 - Chrysler, Gregory M. ; et al.	2002-06-20

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