WATTS; Nicholas R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for WATTS; Nicholas R..The latest application filed is for "offset interposers for large-bottom packages and large-die package-on-package structures".

Company Profile

1.17.20

WATTS; Nicholas R. - Phoenix AZ
Watts; Nicholas R. - Phenix AZ
Watts, Nicholas R. - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20220157799 - MORTENSEN; Russell K. ; et al.	2022-05-19
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20200251462 - Kind Code	2020-08-06
Offset interposers for large-bottom packages and large-die package-on-package structures Grant 10,607,976 - Mortensen , et al.	2020-03-31
Offset interposers for large-bottom packages and large-die package-on-package structures Grant 10,446,530 - Mortensen , et al. Oc	2019-10-15
Passive within via Grant 9,960,079 - Myers , et al. May 1, 2	2018-05-01
Semiconductor package with embedded die and its methods of fabrication Grant 9,780,054 - Guzek , et al. October 3, 2	2017-10-03
Pin grid interposer Grant 9,607,937 - Watts , et al. March 28, 2	2017-03-28
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20160218093 - Mortensen; Russell K. ; et al.	2016-07-28
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20160133557 - Mortensen; Russell K. ; et al.	2016-05-12
Semiconductor Package With Embedded Die And Its Methods Of Fabrication App 20150050781 - Guzek; John S. ; et al.	2015-02-19
Semiconductor package with embedded die and its methods of fabrication Grant 8,901,724 - Guzek , et al. December 2, 2	2014-12-02
Method of stiffening coreless package substrate Grant 8,860,205 - Muthukumar , et al. October 14, 2	2014-10-14
Pin Grid Interposer App 20130285242 - Watts; Nicholas R. ; et al.	2013-10-31
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20130271907 - Mortensen; Russell K. ; et al.	2013-10-17
Semiconductor package with embedded die and its methods of fabrication App 20110215464 - Guzek; John Stephen ; et al.	2011-09-08
Method Of Embedding Passive Component Within Via App 20110198723 - Myers; Todd B. ; et al.	2011-08-18
Method of embedding passive component within via Grant 7,952,202 - Myers , et al. May 31, 2	2011-05-31
Method of stiffening coreless package substrate Grant 7,851,269 - Muthukumar , et al. December 14, 2	2010-12-14
Method Of Stiffening Coreless Package Substrate App 20100301492 - Muthukumar; Sriram ; et al.	2010-12-02
Method of stiffening coreless package substrate App 20100207265 - Muthukumar; Sriram ; et al.	2010-08-19
Via including multiple electrical paths Grant 7,737,025 - Myers , et al. June 15, 2	2010-06-15
Method Of Embedding Passive Component Within Via App 20090057910 - Myers; Todd B. ; et al.	2009-03-05
Method of embedding passive component within via Grant 7,275,316 - Myers , et al. October 2, 2	2007-10-02
Via Including Multiple Electrical Paths App 20070117339 - Myers; Todd B. ; et al.	2007-05-24
Via including multiple electrical paths Grant 7,183,653 - Myers , et al. February 27, 2	2007-02-27
Passive within via App 20050224989 - Myers, Todd B. ; et al.	2005-10-13
Via including multiple electrical paths App 20050133918 - Myers, Todd B. ; et al.	2005-06-23
Stacked integrated circuit packages and methods of making the packages App 20050121769 - Watts, Nicholas R. ; et al.	2005-06-09
Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same Grant 6,606,237 - Naito , et al. August 12, 2	2003-08-12
Electronic circuit housing with trench vias and method of fabrication therefor App 20020071256 - Figueroa, David G. ; et al.	2002-06-13

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