Watari; Toshihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Watari; Toshihiko.The latest application filed is for "lsi package having a multilayer ceramic substrate".
- Watari; Toshihiko - Tokyo JP
| Patent | Date |
|---|---|
| LSI package having a multilayer ceramic substrate Grant 4,894,708 - Watari January 16, 1 | 1990-01-16 |
| Integrated circuit package having coaxial pins Grant 4,819,131 - Watari April 4, 1 | 1989-04-04 |
| High density LSI package for logic circuits Grant 4,744,007 - Watari , et al. May 10, 1 | 1988-05-10 |
| High density LSI package for logic circuits Grant 4,652,970 - Watari , et al. March 24, 1 | 1987-03-24 |
| Heat dissipative integrated circuit chip package Grant 4,612,601 - Watari September 16, 1 | 1986-09-16 |
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