Watanuki; Kouhei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Watanuki; Kouhei.The latest application filed is for "metal complex compound comprising b-diketonato ligand".
- Watanuki; Kouhei - Yamaguchi JP
| Patent | Date |
|---|---|
| Metal complex compound comprising .beta.-diketonato ligand Grant 7,595,414 - Kadota , et al. September 29, 2 | 2009-09-29 |
| Metal Complex Compound Comprising B-Diketonato Ligand App 20080254216 - Kadota; Takumi ; et al. | 2008-10-16 |
| Copper complexes and process for formation of copper-containing thin films by using the same Grant 6,992,200 - Kadota , et al. January 31, 2 | 2006-01-31 |
| Copper complexes and process for formatiom of copper-containing thin films by using the same App 20050080282 - Kadota, Takumi ; et al. | 2005-04-14 |
| Organometallic copper complex and preparation of copper thin film by CVD App 20020103394 - Kadota, Takumi ; et al. | 2002-08-01 |
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