Watanabe; Yasukazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Watanabe; Yasukazu.The latest application filed is for "liquid thermosetting resin composition, printed wiring boards and process for their production".
- Watanabe; Yasukazu - Hiroshima JP
- Watanabe; Yasukazu - Hiki-gun JP
| Patent | Date |
|---|---|
| Seat device of a vehicle Grant RE39,101 - Miyahara , et al. May 23, 2 | 2006-05-23 |
| Liquid thermosetting resin composition, printed wiring boards and process for their production Grant 6,916,873 - Yamamoto , et al. July 12, 2 | 2005-07-12 |
| Seat device of a vehicle Grant 6,609,745 - Miyahara , et al. August 26, 2 | 2003-08-26 |
| Liquid thermosetting resin composition, printed wiring boards and process for their production App 20030129383 - Yamamoto, Rieko ; et al. | 2003-07-10 |
| Seat device of a vehicle App 20020153740 - Miyahara, Tamio ; et al. | 2002-10-24 |
| Seat device of a vehicle Grant 6,435,590 - Miyahara , et al. August 20, 2 | 2002-08-20 |
| Seat device of a vehicle App 20020011737 - Miyahara, Tamio ; et al. | 2002-01-31 |
| Seat arrangement of a vehicle Grant 6,129,405 - Miyahara , et al. October 10, 2 | 2000-10-10 |
| Method for the assembly of a sun roof of an automotive vehicle Grant 5,325,585 - Sasaki , et al. July 5, 1 | 1994-07-05 |
| Apparatus for protecting a rear passenger for an automotive vehicle Grant 5,203,600 - Watanabe , et al. April 20, 1 | 1993-04-20 |
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