Watanabe; Yasufumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watanabe; Yasufumi.The latest application filed is for "insulating film for semiconductor integrated circuit".

Company Profile

0.5.6

Watanabe; Yasufumi - Haibara-gun JP
Watanabe; Yasufumi - Gunma JP
Watanabe; Yasufumi - Shizuoka JP
Watanabe; Yasufumi - Meiwa-machi JP
Watanabe, Yasufumi - Oura-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Insulating film for semiconductor integrated circuit Grant 7,750,102 - Watanabe , et al. July 6, 2	2010-07-06
Process for producing exterior member/seal member assembly Grant 7,661,953 - Sekito , et al. February 16, 2	2010-02-16
Film forming composition, insulating film formed by use of the composition, and electronic device Grant 7,612,155 - Watanabe , et al. November 3, 2	2009-11-03
Polymer, film-forming composition comprising the polymer, insulating film formed by using the composition and electronic device Grant 7,514,513 - Watanabe April 7, 2	2009-04-07
Insulating Film For Semiconductor Integrated Circuit App 20080251892 - WATANABE; Yasufumi ; et al.	2008-10-16
Film forming composition, insulating film formed by use of the composition, and electronic device App 20070255003 - Watanabe; Yasufumi ; et al.	2007-11-01
Method of two-stage injection molding of air conditioner outlet vent device Grant 7,229,582 - Yamazaki , et al. June 12, 2	2007-06-12
Polymer, film-forming composition comprising the polymer, insulating film formed by using the composition and electronic device App 20070037941 - Watanabe; Yasufumi	2007-02-15
Process for producing exterior member/seal member assembly App 20060188603 - Sekito; Hisatoshi ; et al.	2006-08-24
Method of two-stage injection molding of air conditioner outlet vent deivce App 20040195721 - Yamazaki, Akira ; et al.	2004-10-07
Process for producing exterior member/seal member assembly App 20030218272 - Sekito, Hisatoshi ; et al.	2003-11-27

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