Watanabe; Seiya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watanabe; Seiya.The latest application filed is for "punch unit, powder press molding device, and method for manufacturing compacted powder pellet".

Company Profile

1.4.5

Watanabe; Seiya - Kariya JP
WATANABE; Seiya - Kariya-city JP
Watanabe; Seiya - Chiyoda-ku JP
Watanabe; Seiya - Kyoto N/A JP
Watanabe; Seiya - Uji-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Punch unit and powder press molding device for manufacturing compacted powder pellet Grant 10,427,215 - Kobayashi , et al. October 1, 2	2019-10-01
Punch Unit, Powder Press Molding Device, And Method For Manufacturing Compacted Powder Pellet App 20170015077 - KOBAYASHI; Eiichi ; et al.	2017-01-19
Rotary electric machine Grant 9,219,396 - Watanabe , et al. December 22, 2	2015-12-22
Rotary Electric Machine App 20150162806 - WATANABE; Seiya ; et al.	2015-06-11
Hexose-pentose cofermenting yeast having excellent xylose fermentability and method for highly efficiently producing ethanol using the same Grant 8,445,243 - Matsushika , et al. May 21, 2	2013-05-21
Pentose Transporter App 20120270290 - Watanabe; Seiya ; et al.	2012-10-25
Hexose-pentose Cofermenting Yeast Having Excellent Xylose Fermentability And Method For Highly Efficiently Producing Ethanol Using The Same App 20110027847 - Matsushika; Akinori ; et al.	2011-02-03
Linker Compound, Probe, And Probe-immobilized Carrier App 20080070795 - Makino; Keisuke ; et al.	2008-03-20

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