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Patent applications and USPTO patent grants for Watanabe; Rihoko.The latest application filed is for "prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board".
Patent | Date |
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Prepreg, metal-clad laminate and printed wiring board Grant 11,407,869 - Kashihara , et al. August 9, 2 | 2022-08-09 |
Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board Grant 11,234,329 - Watanabe , et al. January 25, 2 | 2022-01-25 |
Prepreg, Substrate, Metal-clad Laminate, Semiconductor Package, And Printed Circuit Board App 20210092835 - WATANABE; Rihoko ;   et al. | 2021-03-25 |
Resin Composition, And Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board Each Obtained Using Said Resin Composition App 20210054197 - UMEHARA; Hiroaki ;   et al. | 2021-02-25 |
Resin Composition, And Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board Each Obtained Using Said Resin Composition App 20210032424 - UMEHARA; Hiroaki ;   et al. | 2021-02-04 |
Prepreg, Metal-clad Laminate And Printed Wiring Board App 20200087474 - KASHIHARA; Keiko ;   et al. | 2020-03-19 |
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