Watanabe; Masako

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watanabe; Masako.The latest application filed is for "method for fabricating flip-attached and underfilled semiconductor devices".

Company Profile

0.9.14

Watanabe; Masako - Oita N/A JP
Watanabe; Masako - Tokyo JP
Watanabe; Masako - Oita-shi JP
Watanabe; Masako - Oita-city JP
Watanabe; Masako - Olta JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating flip-attached and underfilled semiconductor devices Grant 8,598,029 - Watanabe , et al. December 3, 2	2013-12-03
Method for Fabricating Flip-Attached and Underfilled Semiconductor Devices App 20120220080 - Watanabe; Masako ; et al.	2012-08-30
Method for fabricating flip-attached and underfilled semiconductor devices Grant 8,193,085 - Watanabe , et al. June 5, 2	2012-06-05
Method for Fabricating Flip-Attached and Underfilled Semiconductor Devices App 20100144098 - WATANABE; Masako ; et al.	2010-06-10
Method for fabricating flip-attached and underfilled semiconductor devices Grant 7,701,071 - Watanabe , et al. April 20, 2	2010-04-20
Composite Type Semiconductor Device Spacer Sheet, Semiconductor Package Using The Same, Composite Type Semiconductor Device Manufacturing Method, And Composite Type Semiconductor Device App 20100090323 - Shinoda; Tomonori ; et al.	2010-04-15
Composite Semiconductor Device, Semiconductor Package And Spacer Sheet Used In The Same, And Method For Manufacturing Composite Semiconductor Device App 20100025837 - Shinoda; Tomonori ; et al.	2010-02-04
Device inspection device, device inspection system using the same, and mobile telephone holding device Grant 7,646,193 - Suzuki , et al. January 12, 2	2010-01-12
Control of Standoff Height Between Packages with a Solder-Embedded Tape App 20080157353 - Watanabe; Masako ; et al.	2008-07-03
Lead-Free Solder App 20070243098 - Ohnishi; Tsukasa ; et al.	2007-10-18
Lead-free solder Grant 7,282,175 - Amagai , et al. October 16, 2	2007-10-16
Device inspection device, device inspection system using the same, and mobile telephone holding device App 20070205751 - Suzuki; Yoshio ; et al.	2007-09-06
Flip-attached and underfilled stacked semiconductor devices App 20070170599 - Amagai; Masazumi ; et al.	2007-07-26
Method for fabricating flip-attached an underfilled semiconductor devices App 20060214314 - Watanabe; Masako ; et al.	2006-09-28
Lead-free solder alloy Grant 7,029,542 - Amagai , et al. April 18, 2	2006-04-18
Semiconductor device and manufacturing method Grant 6,887,778 - Watanabe , et al. May 3, 2	2005-05-03
Lead-free solder alloy App 20050036902 - Amagai, Masazumi ; et al.	2005-02-17
Lead-free solder App 20040262779 - Amagai, Masazumi ; et al.	2004-12-30
Assembly of semiconductor device and wiring substrate Grant 6,762,506 - Amagai , et al. July 13, 2	2004-07-13
Assembly of semiconductor device and wiring substrate App 20030173587 - Amagai, Masazumi ; et al.	2003-09-18
Semiconductor device and mounting method App 20030132520 - Watanabe, Masako ; et al.	2003-07-17
Semiconductor device and manufacturing method App 20030068847 - Watanabe, Masako ; et al.	2003-04-10

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