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Patent applications and USPTO patent grants for Watanabe; Mami.The latest application filed is for "tin or tin-alloy plating liquid, bump forming method, and circuit board production method".
Patent | Date |
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Tin or tin alloy plating solution Grant 11,268,203 - Watanabe , et al. March 8, 2 | 2022-03-08 |
Plating liquid Grant 11,174,565 - Watanabe , et al. November 16, 2 | 2021-11-16 |
Tin or tin alloy plating solution Grant 11,162,182 - Watanabe , et al. November 2, 2 | 2021-11-02 |
Tin Or Tin-alloy Plating Liquid, Bump Forming Method, And Circuit Board Production Method App 20210040636 - Watanabe; Mami ;   et al. | 2021-02-11 |
Tin Or Tin Alloy Plating Solution App 20200378025 - Watanabe; Mami ;   et al. | 2020-12-03 |
Tin Or Tin Alloy Plating Solution App 20200378024 - Watanabe; Mami ;   et al. | 2020-12-03 |
Plating Liquid App 20200378023 - Watanabe; Mami ;   et al. | 2020-12-03 |
Plating solution using ammonium salt Grant 10,450,665 - Watanabe , et al. Oc | 2019-10-22 |
Plating solution using sulfonium salt Grant 10,329,680 - Nakaya , et al. | 2019-06-25 |
Plating solution using phosphonium salt Grant 10,174,434 - Nakaya , et al. J | 2019-01-08 |
Plating Solution Using Ammonium Salt App 20180057953 - Watanabe; Mami ;   et al. | 2018-03-01 |
Plating Solution Using Phosphonium Salt App 20180051383 - Nakaya; Kiyotaka ;   et al. | 2018-02-22 |
Plating Solution Using Sulfonium Salt App 20180051384 - Nakaya; Kiyotaka ;   et al. | 2018-02-22 |
High-purity electrolytic copper and electrolytic refining method thereof Grant 9,783,904 - Watanabe , et al. October 10, 2 | 2017-10-10 |
High-purity Electrolytic Copper And Electrolytic Refining Method Thereof App 20130334057 - Watanabe; Mami ;   et al. | 2013-12-19 |
Highly Pure Copper Anode For Electrolytic Copper Plating, Method For Manufacturing Same, And Electrolytic Copper Plating Method App 20130075272 - Nakaya; Kiyotaka ;   et al. | 2013-03-28 |
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