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name:-0.0084488391876221
name:-0.0055859088897705
Watanabe; Mami Patent Filings

Watanabe; Mami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watanabe; Mami.The latest application filed is for "tin or tin-alloy plating liquid, bump forming method, and circuit board production method".

Company Profile
5.7.10
  • Watanabe; Mami - Naka JP
  • Watanabe; Mami - Naka-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tin or tin alloy plating solution
Grant 11,268,203 - Watanabe , et al. March 8, 2
2022-03-08
Plating liquid
Grant 11,174,565 - Watanabe , et al. November 16, 2
2021-11-16
Tin or tin alloy plating solution
Grant 11,162,182 - Watanabe , et al. November 2, 2
2021-11-02
Tin Or Tin-alloy Plating Liquid, Bump Forming Method, And Circuit Board Production Method
App 20210040636 - Watanabe; Mami ;   et al.
2021-02-11
Tin Or Tin Alloy Plating Solution
App 20200378025 - Watanabe; Mami ;   et al.
2020-12-03
Tin Or Tin Alloy Plating Solution
App 20200378024 - Watanabe; Mami ;   et al.
2020-12-03
Plating Liquid
App 20200378023 - Watanabe; Mami ;   et al.
2020-12-03
Plating solution using ammonium salt
Grant 10,450,665 - Watanabe , et al. Oc
2019-10-22
Plating solution using sulfonium salt
Grant 10,329,680 - Nakaya , et al.
2019-06-25
Plating solution using phosphonium salt
Grant 10,174,434 - Nakaya , et al. J
2019-01-08
Plating Solution Using Ammonium Salt
App 20180057953 - Watanabe; Mami ;   et al.
2018-03-01
Plating Solution Using Phosphonium Salt
App 20180051383 - Nakaya; Kiyotaka ;   et al.
2018-02-22
Plating Solution Using Sulfonium Salt
App 20180051384 - Nakaya; Kiyotaka ;   et al.
2018-02-22
High-purity electrolytic copper and electrolytic refining method thereof
Grant 9,783,904 - Watanabe , et al. October 10, 2
2017-10-10
High-purity Electrolytic Copper And Electrolytic Refining Method Thereof
App 20130334057 - Watanabe; Mami ;   et al.
2013-12-19
Highly Pure Copper Anode For Electrolytic Copper Plating, Method For Manufacturing Same, And Electrolytic Copper Plating Method
App 20130075272 - Nakaya; Kiyotaka ;   et al.
2013-03-28

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