Watanabe; Kimihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Watanabe; Kimihiro.The latest application filed is for "polishing pad and method for manufacturing semiconductor device".
- Watanabe; Kimihiro - Seto JP
- Watanabe; Kimihiro - Osaka JP
- Watanabe, Kimihiro - Seto-shi JP
- Watanabe; Kimihiro - Ayase JP
| Patent | Date |
|---|---|
| Vitrified bond tool and method of manufacturing the same Grant 7,044,990 - Ishizaki , et al. May 16, 2 | 2006-05-16 |
| Polishing pad and method for manufacturing semiconductor device App 20060037699 - Nakamori; Masahiko ; et al. | 2006-02-23 |
| Vitrified bond tool and method of manufacturing the same App 20040185763 - Ishizaki, Junji ; et al. | 2004-09-23 |
| Vitrified bond tool and method of manufacturing the same Grant 6,755,720 - Ishizaki , et al. June 29, 2 | 2004-06-29 |
| Amino sugar derivatives containing trehalose Grant 4,273,765 - Suhara , et al. June 16, 1 | 1981-06-16 |
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