| Patent | Date |
|---|
Electrical Overlay Measurement Methods And Structures For Wafer-to-wafer Bonding
App 20220285234 - YOKOMIZO; Ikue ; et al. | 2022-09-08 |
Method for producing plated shaped structure and photosensitive resin composition for production of plated shaped structures
Grant 11,249,398 - Sakakibara , et al. February 15, 2 | 2022-02-15 |
Bonded Assembly Containing Side Bonding Structures And Methods Of Manufacturing The Same
App 20200321324 - Sano; Michiaki ; et al. | 2020-10-08 |
Bonded assembly containing side bonding structures and methods of manufacturing the same
Grant 10,797,035 - Sano , et al. October 6, 2 | 2020-10-06 |
Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer
Grant 10,790,296 - Yamaha , et al. September 29, 2 | 2020-09-29 |
Method For Producing Plated Shaped Structure And Photosensitive Resin Composition For Production Of Plated Shaped Structures
App 20190391489 - Sakakibara; Hirokazu ; et al. | 2019-12-26 |
Variable displacement swash plate compressor
Grant 10,309,382 - Teraya , et al. | 2019-06-04 |
Three-dimensional memory device having L-shaped word lines and a support structure and methods of making the same
Grant 10,217,746 - Kim , et al. Feb | 2019-02-26 |
Three-dimensional memory device containing word lines having vertical protrusion regions and methods of making the same
Grant 10,211,215 - Ishii , et al. Feb | 2019-02-19 |
Three-dimensional memory device having L-shaped word lines and methods of making the same
Grant 10,181,442 - Watanabe , et al. Ja | 2019-01-15 |
Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
Grant 9,809,489 - Shimoda , et al. November 7, 2 | 2017-11-07 |
Variable Displacement Swash Plate Compressor
App 20170122300 - Teraya; Takanori ; et al. | 2017-05-04 |
Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection
Grant 9,543,201 - Ookita , et al. January 10, 2 | 2017-01-10 |
Composition For Forming A Conductive Film, A Conductive Film, A Method For Producing A Plating Film, A Plating Film, And An Electronic Device
App 20160081189 - SHIMODA; Sugirou ; et al. | 2016-03-17 |
Method For Forming Three-dimensional Interconnection, Circuit Arrangement Comprising Three-dimensional Interconnection, And Metal Film-forming Composition For Three-dimensional Interconnection
App 20160064280 - OOKITA; Kenzou ; et al. | 2016-03-03 |
Metal Film Forming Method And Conductive Ink Used In Said Method
App 20160057866 - SHIMODA; Sugirou ; et al. | 2016-02-25 |
Manufacturing method of semiconductor device, semiconductor device and electronic apparatus
Grant 9,099,534 - Watanabe , et al. August 4, 2 | 2015-08-04 |
Manufacturing Method Of Semiconductor Device, Semiconductor Device And Electronic Apparatus
App 20140329353 - Watanabe; Kazuto ; et al. | 2014-11-06 |
Manufacturing method of semiconductor device, semiconductor device and electronic apparatus
Grant 8,786,089 - Watanabe , et al. July 22, 2 | 2014-07-22 |
Manufacturing Method Of Semiconductor Device, Semiconductor Device And Electronic Apparatus
App 20120211879 - WATANABE; Kazuto ; et al. | 2012-08-23 |
Method for Machining Valve Mechanism Component Member
App 20100155382 - Tanihara; Hiroyuki ; et al. | 2010-06-24 |
Process for treating solid surface and substrate surface
Grant 7,264,677 - Nakahara , et al. September 4, 2 | 2007-09-04 |
Process for treating solid surface and substrate surface
Grant 7,025,896 - Nakahara , et al. April 11, 2 | 2006-04-11 |
Process for treating solid surface and substrate surface
App 20060037627 - Nakahara; Miwako ; et al. | 2006-02-23 |
Method for manufacturing semiconductor device having an etching treatment
Grant 6,664,184 - Nakahara , et al. December 16, 2 | 2003-12-16 |
Process for treating solid surface and substrate surface
App 20030205553 - Nakahara, Miwako ; et al. | 2003-11-06 |
Process for treating solid surface and substrate surface
Grant 6,613,242 - Nakahara , et al. September 2, 2 | 2003-09-02 |
Process for treating solid surface and substrate surface
Grant 6,537,461 - Nakahara , et al. March 25, 2 | 2003-03-25 |
Method and apparatus for manufacturing semiconductor device
App 20030017701 - Nakahara, Miwako ; et al. | 2003-01-23 |
Process for treating solid surface and substrate surface
App 20020070194 - Nakahara, Miwako ; et al. | 2002-06-13 |
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