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Watanabe; Itsuro Patent Filings

Watanabe; Itsuro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watanabe; Itsuro.The latest application filed is for "curved plate machining apparatus, and method of manufacturing curved plate with machined outer circumference".

Company Profile
2.4.3
  • Watanabe; Itsuro - Tokyo JP
  • Watanabe; Itsuro - Chiyoda-ku JP
  • Watanabe; Itsuro - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Curved plate machining apparatus, and method of manufacturing curved plate with machined outer circumference
Grant 11,090,767 - Ito , et al. August 17, 2
2021-08-17
Curved Plate Machining Apparatus, And Method Of Manufacturing Curved Plate With Machined Outer Circumference
App 20190270166 - ITO; Masabumi ;   et al.
2019-09-05
Laminated glass and vehicle window
Grant 10,259,294 - Yamakawa , et al.
2019-04-16
Method and apparatus for polishing a substrate
Grant 7,210,982 - Watanabe , et al. May 1, 2
2007-05-01
Method And Apparatus For Polishing A Substrate
App 20070000874 - Watanabe; Itsuro ;   et al.
2007-01-04
Method and apparatus for polishing a substrate
Grant 7,115,022 - Watanabe , et al. October 3, 2
2006-10-03
Method and apparatus for polishing a substrate
App 20050130386 - Watanabe, Itsuro ;   et al.
2005-06-16

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