Watanabe; Itsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watanabe; Itsuo.The latest application filed is for "adhesive for bonding circuit members, circuit board and process for its production".

Company Profile

2.36.30

Watanabe; Itsuo - Chikusei N/A JP
Watanabe; Itsuo - Shimodate JP
Watanabe; Itsuo - Ibaraki JP
Watanabe; Itsuo - Chikusei-shi JP
Watanabe; Itsuo - Ibaraki-ken JP
Watanabe; Itsuo - Shimodate-shi JP
Watanabe; Itsuo - Simodate JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same Grant 8,501,045 - Arifuku , et al. August 6, 2	2013-08-06
Adhesive for bonding circuit members, circuit board and process for its production Grant 8,273,457 - Watanabe , et al. September 25, 2	2012-09-25
Adhesive for bonding circuit members, circuit board and process for its production Grant 8,273,458 - Watanabe , et al. September 25, 2	2012-09-25
Adhesive for bonding circuit members, circuit board and process for its production Grant 8,252,419 - Watanabe , et al. August 28, 2	2012-08-28
Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same Grant 8,202,622 - Arifuku , et al. June 19, 2	2012-06-19
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 8,142,605 - Watanabe , et al. March 27, 2	2012-03-27
Wiring terminal-connecting adhesive Grant 8,120,189 - Arifuku , et al. February 21, 2	2012-02-21
Adhesive, method of connecting wiring terminals and wiring structure Grant 8,115,322 - Arifuku , et al. February 14, 2	2012-02-14
Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same Grant 8,043,709 - Arifuku , et al. October 25, 2	2011-10-25
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20110247873 - WATANABE; Itsuo ; et al.	2011-10-13
Circuit Connecting Material, Film-form Circuit Connecting Material Using The Same, Circuit Member Connecting Structure And Method Of Manufacturing The Same App 20110247870 - Arifuku; Motohiro ; et al.	2011-10-13
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20110247867 - WATANABE; Itsuo ; et al.	2011-10-13
Circuit Connection Material, Film-form Circuit Connecting Material Using The Same, Circuit Member Connecting Structure, And Method Of Manufacturing The Same App 20110247757 - ARIFUKU; Motohiro ; et al.	2011-10-13
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20110247874 - WATANABE; Itsuo ; et al.	2011-10-13
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,968,196 - Watanabe , et al. June 28, 2	2011-06-28
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,967,943 - Watanabe , et al. June 28, 2	2011-06-28
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20110114893 - Watanabe; Itsuo ; et al.	2011-05-19
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,879,956 - Watanabe , et al. February 1, 2	2011-02-01
Adhesive for bonding circuit members, circuit board and process for its production Grant 7,879,445 - Watanabe , et al. February 1, 2	2011-02-01
Adhesive, Method Of Connecting Wiring Terminals And Wiring Structure App 20100326596 - ARIFUKU; Motohiro ; et al.	2010-12-30
Adhesive, Method Of Connecting Wiring Terminals And Wiring Structure App 20100330364 - ARIFUKU; Motohiro ; et al.	2010-12-30
Wiring-connecting Material And Wiring-connected Board Production Process Using The Same App 20100265685 - Fujinawa; Tohru ; et al.	2010-10-21
Adhesive film for circuit connection, and circuit connection structure Grant 7,785,708 - Tatsuzawa , et al. August 31, 2	2010-08-31
Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles Grant 7,777,335 - Arifuku , et al. August 17, 2	2010-08-17
Adhesive film for circuit connection, and circuit connection structure Grant 7,776,438 - Tatsuzawa , et al. August 17, 2	2010-08-17
Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof App 20100025089 - Taketatsu; Jun ; et al.	2010-02-04
Circuit Connecting Material, Film-form Circuit Connecting Material Using The Same, Circuit Member Connecting Structure And Method Of Manufacturing The Same App 20090321116 - Arifuku; Motohiro ; et al.	2009-12-31
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20090314533 - Watanabe; Itsuo ; et al.	2009-12-24
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,629,050 - Watanabe , et al. December 8, 2	2009-12-08
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,629,056 - Watanabe , et al. December 8, 2	2009-12-08
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,618,713 - Watanabe , et al. November 17, 2	2009-11-17
Electronic circuit including circuit-connecting material Grant 7,604,868 - Watanabe , et al. October 20, 2	2009-10-20
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,553,890 - Watanabe , et al. June 30, 2	2009-06-30
Adhesive, Method Of Connecting Wiring Terminals And Wiring Structure App 20090101279 - Arifuki; Motohiro ; et al.	2009-04-23
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20080064233 - Watanabe; Itsuo ; et al.	2008-03-13
Adhesive film for circuit connection, and circuit connection structure App 20080064849 - Tatsuzawa; Takashi ; et al.	2008-03-13
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20080054225 - Watanabe; Itsuo ; et al.	2008-03-06
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20080057742 - Watanabe; Itsuo ; et al.	2008-03-06
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20070299172 - Watanabe; Itsuo ; et al.	2007-12-27
Adhesive for bonding circuit members, circuit board, and method of producing the same Grant 7,247,381 - Watanabe , et al. July 24, 2	2007-07-24
Adhesive, method of connecting wiring terminals and wiring structure Grant 7,241,644 - Arifuku , et al. July 10, 2	2007-07-10
Adhesive for bonding circuit members, circuit board and process for its production App 20070137887 - Watanabe; Itsuo ; et al.	2007-06-21
Wiring-connecting material and wiring-connected board production process using the same Grant 7,141,645 - Fujinawa , et al. November 28, 2	2006-11-28
Wiring-connecting material and wiring-connected board production process using the same App 20060252843 - Fujinawa; Tohru ; et al.	2006-11-09
Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same App 20060100314 - Arifuku; Motohiro ; et al.	2006-05-11
Circuit-connecting material and circuit terminal connected structure and connecting method App 20060063366 - Watanabe; Itsuo ; et al.	2006-03-23
Electronic circuit including circuit-connecting material App 20060060969 - Watanabe; Itsuo ; et al.	2006-03-23
Circuit-connecting material and circuit terminal connected structure and connecting method App 20060014860 - Watanabe; Itsuo ; et al.	2006-01-19
Adhesive agent, method of connecting wiring terminals and wiring structure Grant 6,939,913 - Arifuku , et al. September 6, 2	2005-09-06
Adhesive, method of connecting wiring terminals and wiring structure App 20050178502 - Arifuku, Motohiro ; et al.	2005-08-18
Adhesive, method of connecting wiring terminals and wiring structure App 20050176882 - Arifuku, Motohiro ; et al.	2005-08-11
Adhesive film for circuit connection, and circuit connection structure App 20050151271 - Tatsuzawa, Takashi ; et al.	2005-07-14
Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method Grant 6,818,086 - Arifuku , et al. November 16, 2	2004-11-16
Circuit-connecting material and circuit terminal connected structure and connecting method App 20040222408 - Watanabe, Itsuo ; et al.	2004-11-11
Wiring-connecting material and wiring-connected board production process using the same App 20040214979 - Fujinawa, Tohru ; et al.	2004-10-28
Circuit connecting material, and structure and method of connecting circuit terminal Grant 6,777,464 - Watanabe , et al. August 17, 2	2004-08-17
Wiring-connecting material and process for producing circuit board with the same Grant 6,762,249 - Fujinawa , et al. July 13, 2	2004-07-13
Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method App 20030101580 - Arifuku, Motohiro ; et al.	2003-06-05
Process for the fabrication of wiring board for electrical tests Grant 6,568,073 - Fukutomi , et al. May 27, 2	2003-05-27
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet Grant 6,338,195 - Tsukagoshi , et al. January 15, 2	2002-01-15
Substrate for mounting semiconductor chips Grant 6,281,450 - Urasaki , et al. August 28, 2	2001-08-28
Method of production of semiconductor device Grant 6,223,429 - Kaneda , et al. May 1, 2	2001-05-01
Electronic component parts device Grant 6,184,577 - Takemura , et al. February 6, 2	2001-02-06
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet Grant 6,034,331 - Tsukagoshi , et al. March 7, 2	2000-03-07
Information recording medium having recording layer with organic polymer and dye contained therein Grant 5,648,135 - Watanabe , et al. July 15, 1	1997-07-15

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