Watanabe; Hisayasu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Watanabe; Hisayasu.The latest application filed is for "flat cutting tool".
- Watanabe; Hisayasu - Aichi JP
- Watanabe; Hisayasu - Niwa-gun JP
| Patent | Date |
|---|---|
| Flat Cutting Tool App 20110030526 - Miyazaki; Toshimasa ; et al. | 2011-02-10 |
| Bonded layer protection structure for wear resistant component Grant 6,817,103 - Ogura , et al. November 16, 2 | 2004-11-16 |
| Bonded layer protection structure for wear resistant component App 20020139486 - Ogura, Norio ; et al. | 2002-10-03 |
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