| Patent | Date |
|---|
Vane Pump
App 20180306184 - NAKAMURA; Yoshinari ; et al. | 2018-10-25 |
Printed wiring board
Grant 9,795,027 - Watanabe , et al. October 17, 2 | 2017-10-17 |
Printed wiring board
Grant 9,549,460 - Watanabe , et al. January 17, 2 | 2017-01-17 |
Flexible printed circuit and method of manufacturing same
Grant 9,247,651 - Watanabe January 26, 2 | 2016-01-26 |
Printed Wiring Board
App 20150340751 - WATANABE; Hirohito ; et al. | 2015-11-26 |
Printed Wiring Board
App 20150342030 - WATANABE; Hirohito ; et al. | 2015-11-26 |
Differential signal transmission circuit and method for manufacturing same
Grant 9,055,676 - Watanabe June 9, 2 | 2015-06-09 |
Method of manufacturing printed circuit board and printed circuit board
Grant 9,006,579 - Inaba , et al. April 14, 2 | 2015-04-14 |
Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationship
Grant 8,841,976 - Ogawa , et al. September 23, 2 | 2014-09-23 |
Flexible printed board and method of manufacturing same
Grant 8,809,687 - Watanabe August 19, 2 | 2014-08-19 |
Method for manufacturing printed wiring board
Grant 8,574,449 - Watanabe , et al. November 5, 2 | 2013-11-05 |
Printed circuit board and method for manufacturing the same
Grant 8,546,696 - Watanabe October 1, 2 | 2013-10-01 |
Differential Signal Transmission Circuit And Method For Manufacturing Same
App 20130161077 - Watanabe; Hirohito | 2013-06-27 |
Printed Wiring Board
App 20130133930 - WATANABE; Hirohito | 2013-05-30 |
Printed Wiring Board
App 20130133931 - WATANABE; Hirohito ; et al. | 2013-05-30 |
Flexible Printed Circuit Board
App 20130093532 - Watanabe; Hirohito ; et al. | 2013-04-18 |
Method Of Manufacturing Printed Circuit Board And Printed Circuit Board
App 20130087370 - INABA; Masatoshi ; et al. | 2013-04-11 |
Flexible Printed Circuit And Method Of Manufacturing The Same
App 20120292085 - Watanabe; Hirohito | 2012-11-22 |
Method For Manufacturing Printed Wiring Board
App 20120279050 - WATANABE; Hirohito ; et al. | 2012-11-08 |
Printed Wiring Board
App 20120205141 - OGAWA; Taiji ; et al. | 2012-08-16 |
Socket contact terminal and semiconductor device
Grant 8,177,561 - Ouchi , et al. May 15, 2 | 2012-05-15 |
Flexible Printed Board And Method Of Manufacturing Same
App 20110247863 - WATANABE; Hirohito | 2011-10-13 |
Nonvolatile semiconductor storage unit and production method therefor
Grant 7,880,215 - Watanabe , et al. February 1, 2 | 2011-02-01 |
Printed Circuit Board And Method For Manufacturing The Same
App 20100319972 - WATANABE; Hirohito | 2010-12-23 |
Flexible Printed Circuit And Method Of Manufacturing Same
App 20100307797 - WATANABE; Hirohito | 2010-12-09 |
Semiconductor device and manufacturing method thereof
Grant 7,838,945 - Saitoh , et al. November 23, 2 | 2010-11-23 |
Semiconductor device having high dielectric constant layers of different thicknesses
Grant 7,759,744 - Kimizuka , et al. July 20, 2 | 2010-07-20 |
Semiconductor device, production method and production device thereof
Grant 7,679,148 - Watanabe , et al. March 16, 2 | 2010-03-16 |
Socket Contact Terminal And Semiconductor Device
App 20090250256 - Ouchi; Yasuhiro ; et al. | 2009-10-08 |
Semiconductor Device And Manufacturing Method Thereof
App 20090096032 - Saitoh; Motofumi ; et al. | 2009-04-16 |
Semiconductor device and production method therefor
App 20080203500 - Ogura; Takashi ; et al. | 2008-08-28 |
Nonvolatile Semiconductor Storage Unit and Production Method Therefor
App 20080144377 - Watanabe; Hirohito ; et al. | 2008-06-19 |
Semiconductor device
Grant 7,238,996 - Kimizuka , et al. July 3, 2 | 2007-07-03 |
Optical fiber and optical fiber cable using the same
Grant 7,072,554 - Watanabe , et al. July 4, 2 | 2006-07-04 |
Semiconductor device and production method therefor
App 20060131670 - Ogura; Takashi ; et al. | 2006-06-22 |
Semiconductor device
App 20050263802 - Kimizuka, Naohiko ; et al. | 2005-12-01 |
Semiconductor device
App 20050253181 - Kimizuka, Naohiko ; et al. | 2005-11-17 |
Semiconductor device, production method and production device thereof
App 20050233526 - Watanabe, Heiji ; et al. | 2005-10-20 |
Optical fiber drop cable
Grant 6,853,782 - Kobayashi , et al. February 8, 2 | 2005-02-08 |
Optical fiber and optical fiber cable having a first jacket layer and a second jacket layer and a coefficient of thermal expansion selecting method
Grant 6,804,442 - Watanabe , et al. October 12, 2 | 2004-10-12 |
Optical fiber and optical fiber cable using the same
App 20040028366 - Watanabe, Hirohito ; et al. | 2004-02-12 |
Drop cable and method of fabricating same
App 20030072545 - Kusakari, Masahiro ; et al. | 2003-04-17 |
Optical fiber drop cable
App 20030012529 - Kobayashi, Kazunaga ; et al. | 2003-01-16 |
Optical-fiber cable and method of manufacturing the same
Grant 6,236,790 - Okada , et al. May 22, 2 | 2001-05-22 |
Method of manufacturing thin film capacitor
Grant 6,225,133 - Yamamichi , et al. May 1, 2 | 2001-05-01 |
Process for forming a capacitor incorporated in a semiconductor device
Grant 6,146,966 - Hirota , et al. November 14, 2 | 2000-11-14 |
Vapor selective etching method and apparatus
Grant 6,024,888 - Watanabe , et al. February 15, 2 | 2000-02-15 |
Stacked capacitor having a corrugated electrode
Grant 6,022,772 - Watanabe , et al. February 8, 2 | 2000-02-08 |
Nonvolatile semiconductor memory device and manufacturing method of the same
Grant 5,973,355 - Shirai , et al. October 26, 1 | 1999-10-26 |
Capacitor incorporated in semiconductor device having a lower electrode composed of multi-layers or of graded impurity concentration
Grant 5,959,326 - Aiso , et al. September 28, 1 | 1999-09-28 |
Method of producing silicon layer having surface controlled to be uneven or even
Grant 5,910,019 - Watanabe , et al. June 8, 1 | 1999-06-08 |
Semiconductor device wherein one of capacitor electrodes comprises a conductor pole and conductor layer
Grant 5,753,949 - Honma , et al. May 19, 1 | 1998-05-19 |
Method for fabricating polycrystalline silicon having micro roughness on the surface
Grant 5,691,249 - Watanabe , et al. November 25, 1 | 1997-11-25 |
Method of fabricating semiconductor device having low-resistance gate electrode and diffusion layers
Grant 5,661,052 - Inoue , et al. August 26, 1 | 1997-08-26 |
HF vapor selective etching method and apparatus
Grant 5,658,417 - Watanabe , et al. August 19, 1 | 1997-08-19 |
Semiconductor device having polycrystalline silicon layer with uneven surface defined by hemispherical or mushroom like shape silicon grain
Grant 5,623,243 - Watanabe , et al. April 22, 1 | 1997-04-22 |
Method of producing semiconductor device with insulating film having at least silicon nitride film
Grant 5,397,748 - Watanabe , et al. March 14, 1 | 1995-03-14 |
Method of making a semiconductor integrated circuit device having a capacitor with a porous surface of an electrode
Grant 5,372,962 - Hirota , et al. December 13, 1 | 1994-12-13 |
Method for fabricating polycrystalline silicon having micro roughness on the surface
Grant 5,366,917 - Watanabe , et al. November 22, 1 | 1994-11-22 |
Method for fabricating a thin film capacitor
Grant 5,366,920 - Yamamichi , et al. November 22, 1 | 1994-11-22 |
| 