| Patent | Date |
|---|
Stacked semiconductor die assemblies with die substrate extensions
Grant 11,335,667 - Watanabe , et al. May 17, 2 | 2022-05-17 |
Shielded Fan-out Packaged Semiconductor Device And Method Of Manufacturing
App 20220013421 - Watanabe; Fumitomo ; et al. | 2022-01-13 |
Shielded fan-out packaged semiconductor device and method of manufacturing
Grant 11,158,554 - Watanabe , et al. October 26, 2 | 2021-10-26 |
Semiconductor device, lead frame, and method for manufacturing semiconductor device
App 20210296216 - Fujiwara; Toshitomo ; et al. | 2021-09-23 |
Semiconductor Device Assemblies With Molded Support Substrates
App 20210225805 - Watanabe; Mitsuhisa ; et al. | 2021-07-22 |
Semiconductor device assemblies with molded support substrates
Grant 10,998,290 - Watanabe , et al. May 4, 2 | 2021-05-04 |
Stacked Semiconductor Die Assemblies With Die Substrate Extensions
App 20200321316 - Watanabe; Fumitomo ; et al. | 2020-10-08 |
Shielded Fan-out Packaged Semiconductor Device And Method Of Manufacturing
App 20200051882 - Watanabe; Fumitomo ; et al. | 2020-02-13 |
Stacked semiconductor die assemblies with die substrate extensions
Grant 10,553,566 - Watanabe , et al. Fe | 2020-02-04 |
Shielded fan-out packaged semiconductor device and method of manufacturing
Grant 10,453,762 - Watanabe , et al. Oc | 2019-10-22 |
Semiconductor Device Assemblies With Molded Support Substrates
App 20190148338 - Watanabe; Mitsuhisa ; et al. | 2019-05-16 |
Semiconductor device assemblies with molded support substrates
Grant 10,217,719 - Watanabe , et al. Feb | 2019-02-26 |
Stacked Semiconductor Die Assemblies With Die Substrate Extensions
App 20190043840 - Watanabe; Fumitomo ; et al. | 2019-02-07 |
Shielded Fan-out Packaged Semiconductor Device And Method Of Manufacturing
App 20190035706 - Watanabe; Fumitomo ; et al. | 2019-01-31 |
Stacked semiconductor die assemblies with die substrate extensions
Grant 10,147,705 - Watanabe , et al. De | 2018-12-04 |
Semiconductor Device Assemblies With Molded Support Substrates
App 20180294249 - Watanabe; Mitsuhisa ; et al. | 2018-10-11 |
Stacked Semiconductor Die Assemblies With Die Substrate Extensions
App 20180240782 - Watanabe; Fumitomo ; et al. | 2018-08-23 |
Semiconductor device and method of manufacturing the same
Grant 8,810,047 - Watanabe , et al. August 19, 2 | 2014-08-19 |
Semiconductor device and method of manufacturing the same
Grant 8,786,102 - Yoshida , et al. July 22, 2 | 2014-07-22 |
Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board
Grant 8,710,647 - Kagaya , et al. April 29, 2 | 2014-04-29 |
Semiconductor Device And Method Of Manufacturing The Same
App 20140035161 - YOSHIDA; Masanori ; et al. | 2014-02-06 |
Semiconductor device and method of manufacturing the same
Grant 8,575,763 - Yoshida , et al. November 5, 2 | 2013-11-05 |
Semiconductor Device
App 20120032353 - KAGAYA; Yutaka ; et al. | 2012-02-09 |
Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion
Grant 8,076,770 - Kagaya , et al. December 13, 2 | 2011-12-13 |
Method of manufacturing semiconductor device including mounting and dicing chips
Grant 7,993,975 - Watanabe , et al. August 9, 2 | 2011-08-09 |
Semiconductor device and method of manufacturing the same
Grant 7,928,551 - Fujiwara , et al. April 19, 2 | 2011-04-19 |
Semiconductor Device And Method Of Manufacturing The Same
App 20110057327 - YOSHIDA; Masanori ; et al. | 2011-03-10 |
Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof
Grant 7,888,179 - Kagaya , et al. February 15, 2 | 2011-02-15 |
Semiconductor device and method of manufacturing the same
App 20100102438 - Watanabe; Mitsuhisa ; et al. | 2010-04-29 |
Semiconductor device and method of manufacturing the same
App 20090321920 - Sakurada; Shinichi ; et al. | 2009-12-31 |
Semiconductor Device
App 20090189297 - Sugawara; Katsumi ; et al. | 2009-07-30 |
Semiconductor device and method of manufacturing the same
App 20090166863 - Watanabe; Mitsuhisa ; et al. | 2009-07-02 |
Semiconductor Device And Electronic Device
App 20090129036 - FUJII; SEIYA ; et al. | 2009-05-21 |
Semiconductor device and method of manufacturing the same
App 20090096111 - Fujiwara; Reiko ; et al. | 2009-04-16 |
Semiconductor Device And Method Of Manufacturing The Same
App 20090045497 - KAGAYA; Yutaka ; et al. | 2009-02-19 |
Semiconductor Device Including A Semiconductor Chip Which Is Mounted Spaning A Plurality Of Wiring Boards And Manufacturing Method Thereof
App 20090039506 - Kagaya; Yutaka ; et al. | 2009-02-12 |
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