Wassick; Thomas Anthony

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wassick; Thomas Anthony.The latest application filed is for "high bandwidth module".

Company Profile

3.12.11

Wassick; Thomas Anthony - LaGrangeville NY
WASSICK; THOMAS ANTHONY - HOPEWELL JUNCTION NY
Wassick; Thomas Anthony - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Bandwidth Module App 20220059499 - Arvin; Charles Leon ; et al.	2022-02-24
High bandwidth module Grant 11,201,136 - Arvin , et al. December 14, 2	2021-12-14
High Bandwidth Module App 20210288025 - Arvin; Charles Leon ; et al.	2021-09-16
Flip chip packaging rework Grant 11,121,101 - Arvin , et al. September 14, 2	2021-09-14
Flip Chip Packaging Rework App 20210242146 - Arvin; Charles Leon ; et al.	2021-08-05
Precision alignment of multi-chip high density interconnects Grant 10,833,051 - Arvin , et al. November 10, 2	2020-11-10
Integrated circuit defect detection using pattern images Grant 10,755,404 - Lin , et al. A	2020-08-25
Precision Alignment Of Multi-chip High Density Interconnects App 20200243479 - Arvin; Charles L. ; et al.	2020-07-30
Integrated Circuit Defect Detection Using Pattern Images App 20190180430 - Lin; Chung-Ching ; et al.	2019-06-13
Selective electromigration improvement for high current C4s Grant 8,575,007 - Daubenspeck , et al. November 5, 2	2013-11-05
Electromigration-resistant Lead-free Solder Interconnect Structures App 20130249066 - ARVIN; CHARLES L. ; et al.	2013-09-26
Selective Electromigration Improvement For High Current C4s App 20120248604 - Daubenspeck; Timothy Harrison ; et al.	2012-10-04
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Grant 7,875,502 - Brofman , et al. January 25, 2	2011-01-25
Semiconductor Chips With Crack Stop Regions For Reducing Crack Propagation From Chip Edges/corners App 20100233872 - Brofman; Peter J. ; et al.	2010-09-16
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Grant 7,732,932 - Brofman , et al. June 8, 2	2010-06-08
Semiconductor Chips With Crack Stop Regions For Reducing Crack Propagation From Chip Edges/corners App 20090032909 - Brofman; Peter J. ; et al.	2009-02-05
Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor Grant 7,019,402 - Andry , et al. March 28, 2	2006-03-28
Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor App 20050082676 - Andry, Paul Stephen ; et al.	2005-04-21
Thin film wiring scheme utilizing inter-chip site surface wiring Grant 6,444,919 - Economikos , et al. September 3, 2	2002-09-03
Ablation patterning of multi-layered structures Grant 5,843,363 - Mitwalsky , et al. December 1, 1	1998-12-01
Ablation pattering of multilayered structures Grant 5,766,497 - Mitwalsky , et al. June 16, 1	1998-06-16

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