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Patent applications and USPTO patent grants for Wasilik; Matthew L..The latest application filed is for "wafer-level-packaged baw devices with surface mount connection structures".
Patent | Date |
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BAW devices having top electrode leads with reduced reflectance Grant 10,574,210 - Diep , et al. Feb | 2020-02-25 |
Wafer-level-packaged BAW devices with surface mount connection structures Grant 10,367,470 - Wasilik , et al. July 30, 2 | 2019-07-30 |
Wafer-level-packaged Baw Devices With Surface Mount Connection Structures App 20180109237 - Wasilik; Matthew L. ;   et al. | 2018-04-19 |
Baw Devices Having Top Electrode Leads With Reduced Reflectance App 20170288644 - Diep; Buu Quoc ;   et al. | 2017-10-05 |
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