Washida; Tetsuro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Washida; Tetsuro.The latest application filed is for "semiconductor device".
- Washida; Tetsuro - Tokyo JP
- Washida; Tetsuro - Itami JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 6,144,091 - Washida November 7, 2 | 2000-11-07 |
| Memory module with obstacle removing terminal structure Grant 6,115,260 - Nakajima , et al. September 5, 2 | 2000-09-05 |
| Module mounted with semiconductor device Grant 5,949,135 - Washida , et al. September 7, 1 | 1999-09-07 |
| Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices Grant 5,889,327 - Washida , et al. March 30, 1 | 1999-03-30 |
| IC card Grant 5,886,874 - Onoda , et al. March 23, 1 | 1999-03-23 |
| Bendable circuit board having improved resistance to bending strain and increased element mounting area Grant 5,777,275 - Mizutani , et al. July 7, 1 | 1998-07-07 |
| IC card Grant 5,719,746 - Ohbuchi , et al. February 17, 1 | 1998-02-17 |
| IC card with a discharge pattern and a ground pattern separated from each other Grant 5,671,123 - Omori , et al. September 23, 1 | 1997-09-23 |
| Semiconductor module and IC package used for the semiconductor module Grant 5,521,786 - Gochi , et al. May 28, 1 | 1996-05-28 |
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