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Patent applications and USPTO patent grants for Washburn; Carlton A..The latest application filed is for "assist layers for euv lithography".
Patent | Date |
---|---|
Assist Layers For Euv Lithography App 20130129995 - Ouattara; Tantiboro ;   et al. | 2013-05-23 |
Method of filling structures for forming via-first dual damascene interconnects Grant 7,602,066 - Brakensiek , et al. October 13, 2 | 2009-10-13 |
Developer-soluble materials and methods of using the same in via-first dual damascene applications Grant 7,364,835 - Bhave , et al. April 29, 2 | 2008-04-29 |
Method of filling structures for forming via-first dual damascene interconnects Grant 7,348,281 - Brakensiek , et al. March 25, 2 | 2008-03-25 |
Method Of Filling Structures For Forming Via-first Dual Damascene Interconnects App 20070123036 - Brakensiek; Nickolas L. ;   et al. | 2007-05-31 |
Developer-soluble materials and methods of using the same in via-first dual damascene applications App 20050148170 - Bhave, Mandar ;   et al. | 2005-07-07 |
Method of filling structures for forming via-first dual damascene interconnects App 20050118800 - Brakensiek, Nickolas L. ;   et al. | 2005-06-02 |
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