WARREN; Robert W

Patent Applications and Registrations

Patent applications and USPTO patent grants for WARREN; Robert W.The latest application filed is for "3-d stacking of active devices over passive devices".

Company Profile

1.52.62

WARREN; Robert W - Newport Beach CA
Warren; Robert W. - Newport Beach CA US
Warren; Robert W. - Loveland CO
Warren; Robert W. - Laguna Hills CA
Warren; Robert W. - Rochester MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
3-d Stacking Of Active Devices Over Passive Devices App 20180242455 - KUHLMAN; Mark A. ; et al.	2018-08-23
3-D stacking of active devices over passive devices Grant 9,955,582 - Kuhlman , et al. April 24, 2	2018-04-24
Spot plated leadframe and IC bond pad via array design for copper wire Grant 9,230,928 - Warren , et al. January 5, 2	2016-01-05
Semiconductor package with corner pins Grant 9,142,491 - Warren , et al. September 22, 2	2015-09-22
Methods Related To Fabrication Of Shielded Radio-frequency Module App 20150255403 - HOANG; Dinhphuoc V. ; et al.	2015-09-10
Packaged Radio-frequency Module Having Wirebond Shielding App 20150255402 - HOANG; Dinhphuoc V. ; et al.	2015-09-10
Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding Grant 9,054,115 - Hoang , et al. June 9, 2	2015-06-09
Overmolded semiconductor package with wirebonds for electromagnetic shielding Grant 9,041,168 - Hoang , et al. May 26, 2	2015-05-26
Semiconductor packages with reduced solder voiding Grant 9,029,991 - Warren , et al. May 12, 2	2015-05-12
Systems and methods for managing end of life in a solid state drive Grant 8,745,449 - Dreifus , et al. June 3, 2	2014-06-03
Ultra fast disk access using arrays of fixed read/write transducers Grant 8,693,126 - Buckholdt , et al. April 8, 2	2014-04-08
Semiconductor Package with Corner Pins App 20140091448 - Warren; Robert W. ; et al.	2014-04-03
Systems and methods for variable level use of a multi-level flash memory Grant 8,560,765 - Warren October 15, 2	2013-10-15
Wafer level package with thermal pad for higher power dissipation Grant 8,552,540 - Warren , et al. October 8, 2	2013-10-08
Copper Sphere Array Package App 20130256885 - Warren; Robert W. ; et al.	2013-10-03
Shielded USB connector module with molded hood and LED light pipe Grant 8,540,529 - Warren , et al. September 24, 2	2013-09-24
Solid Via Pins For Improved Thermal And Electrical Conductivity App 20130208424 - Warren; Robert W. ; et al.	2013-08-15
Systems and methods for re-designating memory regions as error code corrected memory regions Grant 8,499,220 - Warren July 30, 2	2013-07-30
Systems and methods for selecting bit per cell density of a memory cell based on data typing Grant 8,458,416 - Warren , et al. June 4, 2	2013-06-04
Systems and methods of tamper proof packaging of a semiconductor device Grant 8,455,990 - Warren , et al. June 4, 2	2013-06-04
Copper Stud Bump Wafer Level Package App 20130087915 - Warren; Robert W. ; et al.	2013-04-11
Overmolded semiconductor package with a wirebond cage for EMI shielding Grant 8,399,972 - Hoang , et al. March 19, 2	2013-03-19
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire App 20130062742 - Warren; Robert W. ; et al.	2013-03-14
Systems and methods for implementing error correction in relation to a flash memory Grant 8,381,077 - Warren February 19, 2	2013-02-19
Shielded USB Connector Module with Molded Hood and LED Light Pipe App 20130034990 - Warren; Robert W. ; et al.	2013-02-07
Externally Wire Bondable Chip Scale Package in a System-in-Package Module App 20120326304 - Warren; Robert W. ; et al.	2012-12-27
Wafer Level Package With Thermal Pad For Higher Power Dissipation App 20120286408 - Warren; Robert W. ; et al.	2012-11-15
Systems and methods for mobile data storage and acquisition Grant 8,301,195 - Warren , et al. October 30, 2	2012-10-30
Systems and methods for extended life multi-bit memory cells Grant 8,289,768 - Warren , et al. October 16, 2	2012-10-16
Power management in data storage device determining utilization of a control circuit by its rate of command processing Grant 8,286,018 - Chang , et al. October 9, 2	2012-10-09
Quantum burst arbiter and memory controller Grant 8,285,892 - Arntzen , et al. October 9, 2	2012-10-09
Unpackaged and packaged IC stacked in a system-in-package module App 20120241954 - Warren; Robert W. ; et al.	2012-09-27
Systems and methods for increasing bit density in a memory cell Grant 8,243,536 - Warren August 14, 2	2012-08-14
Systems and methods for peak power and/or EMI reduction Grant 8,243,546 - Warren August 14, 2	2012-08-14
Integrated led in system-in-package module App 20120188738 - Warren; Robert W. ; et al.	2012-07-26
Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding App 20120146178 - Hoang; Dinhphuoc V. ; et al.	2012-06-14
Methods For Fabricating An Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding App 20120137514 - Hoang; Dinhphuoc V. ; et al.	2012-06-07
Semiconductor packages with reduced solder voiding App 20120119341 - Warren; Robert W. ; et al.	2012-05-17
Systems and methods for circular buffering control in a memory device Grant 8,174,912 - Warren May 8, 2	2012-05-08
Systems and methods for managing end of life in a solid state drive Grant 8,176,367 - Dreifus , et al. May 8, 2	2012-05-08
Systems and Methods for Managing End of Life in a Solid State Drive App 20120110376 - Dreifus; David L. ; et al.	2012-05-03
Systems and methods for improved heat dissipation in semiconductor packages App 20120104591 - Warren; Robert W. ; et al.	2012-05-03
Systems and Methods for Tiered Non-Volatile Storage App 20120102261 - Burger; Harley ; et al.	2012-04-26
Systems and methods for governing the life cycle of a solid state drive Grant 8,151,137 - McKean , et al. April 3, 2	2012-04-03
Systems and Methods for Heat Dissipation Using Thermal Conduits App 20120032350 - Warren; Robert W. ; et al.	2012-02-09
Overmolded semiconductor package with a wirebond cage for EMI shielding Grant 8,071,431 - Hoang , et al. December 6, 2	2011-12-06
Quantum Burst Arbiter And Memory Controller App 20110276727 - Arntzen; Eskild T. ; et al.	2011-11-10
Ultra Fast Disk Access Using Arrays Of Fixed Read/write Transducers App 20110228422 - Buckholdt; Wayne L. ; et al.	2011-09-22
Enhanced thermal dissipation ball grid array package Grant 8,013,440 - Warren September 6, 2	2011-09-06
Gaas Integrated Circuit Device And Method Of Attaching Same App 20110186966 - Shen; Hong ; et al.	2011-08-04
Systems and Methods for Extended Life Multi-Bit Memory Cells App 20110185111 - Warren; Robert W. ; et al.	2011-07-28
Overmolded Semiconductor Package With A Wirebond Cage For Emi Shielding App 20110084368 - Hoang; Dinphuoc V. ; et al.	2011-04-14
GaAs integrated circuit device and method of attaching same Grant 7,923,842 - Shen , et al. April 12, 2	2011-04-12
Systems and Methods for Variable Level Use of a Multi-Level Flash Memory App 20110060861 - Warren; Robert W.	2011-03-10
Systems and Methods for Switchable Memory Configuration App 20110060862 - Warren; Robert W.	2011-03-10
Systems and Methods for Selecting Bit Per Cell Density of a Memory Cell Based on Data Typing App 20110060886 - Warren; Robert W. ; et al.	2011-03-10
Systems and Methods for Flash Memory Utilization App 20110060865 - Warren; Robert W. ; et al.	2011-03-10
Systems and Methods for Re-Designating Memory Regions as Error Code Corrected Memory Regions App 20110060967 - Warren; Robert W.	2011-03-10
Systems and Methods for Increasing Bit Density in a Memory Cell App 20110058415 - Warren; Robert W.	2011-03-10
Systems and Methods for Implementing Error Correction in Relation to a Flash Memory App 20110060968 - Warren; Robert W.	2011-03-10
Systems and Methods for Peak Power and/or EMI Reduction App 20110058421 - Warren; Robert W.	2011-03-10
Systems and Methods for Circular Buffering Control in a Memory Device App 20110058422 - Warren; Robert W.	2011-03-10
Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging App 20110001230 - Li; Jianjun ; et al.	2011-01-06
Systems and Methods for Governing the Life Cycle of a Solid State Drive App 20100306580 - McKean; Brian D. ; et al.	2010-12-02
Systems and Methods for Managing End of Life in a Solid State Drive App 20100306577 - Dreifus; David L. ; et al.	2010-12-02
Systems and Methods for Image Data Transfer App 20100265348 - Warren; Robert W.	2010-10-21
Systems and Methods of Tamper Proof Packaging of a Semiconductor Device App 20100213590 - Warren; Robert W. ; et al.	2010-08-26
Systems and Methods for Implementing Hands Free Operational Environments App 20100203830 - Warren; Robert W. ; et al.	2010-08-12
Systems And Methods For Enabling Consumption Of Copy-protected Content Across Multiple Devices App 20100202610 - Warren; Robert W. ; et al.	2010-08-12
Wafer level package with cavities for active devices Grant 7,635,606 - Warren , et al. December 22, 2	2009-12-22
Method for fabricating a wafer level package with device wafer and passive component integration Grant 7,629,201 - Gan , et al. December 8, 2	2009-12-08
3-d Stacking Of Active Devices Over Passive Devices App 20090267220 - Kuhlman; Mark A. ; et al.	2009-10-29
Enhanced Thermal Dissipation Ball Grid Array Package App 20090243086 - Warren; Robert W.	2009-10-01
Wafer level package including a device wafer integrated with a passive component Grant 7,576,426 - Gan , et al. August 18, 2	2009-08-18
Systems And Methods For Power Management In Relation To A Wireless Storage Device App 20090193178 - Warren; Robert W. ; et al.	2009-07-30
Systems And Methods For Mobile Data Storage And Acquisition App 20090176529 - Warren; Robert W. ; et al.	2009-07-09
Surface Mount Package With Enhanced Strength Solder Joint App 20090127695 - Kim; Patrick ; et al.	2009-05-21
Wafer level package with cavities for active devices App 20090075431 - Warren; Robert W. ; et al.	2009-03-19
Systems And Methods For Multiport Communication Distribution App 20090061775 - Warren; Robert W. ; et al.	2009-03-05
Systems And Methods For Multi-user Access To A Wireless Storage Device App 20090055408 - Warren; Robert W. ; et al.	2009-02-26
Method for fabricating a wafer level package having through wafer vias for external package connectivity App 20080064142 - GAN; QING ; et al.	2008-03-13
Method for fabricating a wafer level package with device wafer and passive component integration App 20080003761 - Gan; Qing ; et al.	2008-01-03
Overmolded semiconductor package with a wirebond cage for EMI shielding App 20070241440 - Hoang; Dinhphuoc V. ; et al.	2007-10-18
GaAs integrated circuit device and method of attaching same App 20070215897 - Shen; Hong ; et al.	2007-09-20
Overmolded semiconductor package with an integrated EMI and RFI shield Grant 7,198,987 - Warren , et al. April 3, 2	2007-04-03
Packaged electronic devices and process of manufacturing same App 20070070608 - Warren; Robert W. ; et al.	2007-03-29
Using data compression to achieve lower linear bit densities on a storage medium Grant 7,133,228 - Fung , et al. November 7, 2	2006-11-07
Wafer level package including a device wafer integrated with a passive component App 20060220173 - Gan; Qing ; et al.	2006-10-05
Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure App 20060211233 - Gan; Qing ; et al.	2006-09-21
Power management device and method App 20050289368 - Chang, Lai Kein ; et al.	2005-12-29
Using data compression to achieve lower linear bit densities on a storage medium App 20050078399 - Fung, Kendall H. ; et al.	2005-04-14
Method and apparatus for read error recovery Grant 6,862,151 - Hoskins , et al. March 1, 2	2005-03-01
High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill Grant 6,435,883 - Warren August 20, 2	2002-08-20
Top of die chip-on-board encapsulation Grant 5,951,813 - Warren September 14, 1	1999-09-14
Pulsed alignment commutation state for sensorless motor start Grant 5,821,715 - Plutowski , et al. October 13, 1	1998-10-13

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