Wark; James M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wark; James M..The latest application filed is for "semiconductor devices comprising nickel-and copper-containing interconnects".

Company Profile

1.141.93

Wark; James M. - Boise ID
Wark; James M. - Bosie ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor devices comprising nickel-- and copper--containing interconnects Grant 10,446,440 - Akram , et al. Oc	2019-10-15
Semiconductor Devices Comprising Nickel-and Copper-containing Interconnects App 20180358263 - Akram; Salman ; et al.	2018-12-13
Semiconductor devices comprising nickel- and copper-containing interconnects Grant 10,062,608 - Akram , et al. August 28, 2	2018-08-28
Methods Of Forming Interconnects And Semiconductor Structures App 20170283954 - Akram; Salman ; et al.	2017-10-05
Methods of forming interconnects and semiconductor structures Grant 9,640,433 - Akram , et al. May 2, 2	2017-05-02
Methods Of Forming Interconnects And Semiconductor Structures App 20140154879 - Akram; Salman ; et al.	2014-06-05
Through-wafer interconnects for photoimager and memory wafers Grant 8,669,179 - Akram , et al. March 11, 2	2014-03-11
Methods of forming interconnects in a semiconductor structure Grant 8,647,982 - Akram , et al. February 11, 2	2014-02-11
Through-wafer Interconnects For Photoimager And Memory Wafers App 20130295766 - Akram; Salman ; et al.	2013-11-07
Through-wafer interconnects for photoimager and memory wafers Grant 8,502,353 - Akram , et al. August 6, 2	2013-08-06
Methods of forming conductive vias Grant 8,324,100 - Akram , et al. December 4, 2	2012-12-04
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 8,294,273 - Akram , et al. October 23, 2	2012-10-23
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers Grant 7,993,944 - Oliver , et al. August 9, 2	2011-08-09
Methods Of Forming Conductive Vias App 20110136336 - Akram; Salman ; et al.	2011-06-09
Through-wafer interconnects for photoimager and memory wafers Grant 7,956,443 - Akram , et al. June 7, 2	2011-06-07
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed App 20110095429 - Akram; Salman ; et al.	2011-04-28
Devices including sloped vias in a substrate and devices including spring-like deflecting contacts Grant 7,928,579 - Wark , et al. April 19, 2	2011-04-19
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 7,892,972 - Akram , et al. February 22, 2	2011-02-22
Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures Grant 7,855,454 - Akram , et al. December 21, 2	2010-12-21
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,812,436 - Wark October 12, 2	2010-10-12
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,776,652 - Wark August 17, 2	2010-08-17
Device and method for testing integrated circuit dice in an integrated circuit module Grant 7,730,372 - Farnworth , et al. June 1, 2	2010-06-01
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers Grant 7,723,741 - Farnworth , et al. May 25, 2	2010-05-25
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,709,776 - Farnworth , et al. May 4, 2	2010-05-04
Through-wafer interconnects for photoimager and memory wafers Grant 7,683,458 - Akram , et al. March 23, 2	2010-03-23
Semiconductor devices with permanent polymer stencil and method for manufacturing the same Grant 7,589,010 - Farnworth , et al. September 15, 2	2009-09-15
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs Grant 7,561,938 - Akram , et al. July 14, 2	2009-07-14
Methods Of Forming Interconnects In A Semiconductor Structure App 20090176362 - Akram; Salman ; et al.	2009-07-09
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers App 20090155949 - Farnworth; Warren M. ; et al.	2009-06-18
Device and method for testing integrated circuit dice in an integrated circuit module Grant 7,519,881 - Farnworth , et al. April 14, 2	2009-04-14
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,504,615 - Farnworth , et al. March 17, 2	2009-03-17
Semiconductor component having plate, stacked dice and conductive vias Grant 7,498,675 - Farnworth , et al. March 3, 2	2009-03-03
Compliant contact pin assembly and card system Grant 7,488,899 - Kirby , et al. February 10, 2	2009-02-10
Device And Method For Testing Integrated Circuit Dice In An Integrated Circuit Module App 20090027076 - Farnworth; Warren M. ; et al.	2009-01-29
Methods For Stacking Wire-bonded Integrated Circuit Dice On Flip-chip Bonded Integrated Circuit Dice App 20080315435 - Wark; James M.	2008-12-25
Microelectronic Imagers With Optical Devices Having Integral Reference Features And Methods For Manufacturing Such Microelectronic Imagers App 20080318353 - Oliver; Steven D. ; et al.	2008-12-25
Methods For Stacking Wire-bonded Integrated Circuit Dice On Flip-chip Bonded Integrated Circuit Dice App 20080311702 - Wark; James M.	2008-12-18
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts Grant 7,459,393 - Farnworth , et al. December 2, 2	2008-12-02
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level Grant 7,452,743 - Oliver , et al. November 18, 2	2008-11-18
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers Grant 7,429,494 - Oliver , et al. September 30, 2	2008-09-30
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,423,339 - Wark September 9, 2	2008-09-09
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,423,338 - Wark September 9, 2	2008-09-09
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,419,841 - Farnworth , et al. September 2, 2	2008-09-02
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,411,286 - Wark August 12, 2	2008-08-12
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,402,902 - Wark July 22, 2	2008-07-22
Compliant contact pin assembly and card system Grant 7,394,267 - Kirby , et al. July 1, 2	2008-07-01
Sloped vias in a substrate, spring-like contacts, and methods of making Grant 7,390,740 - Wark , et al. June 24, 2	2008-06-24
Contact pin assembly and contactor card Grant 7,358,751 - Kirby , et al. April 15, 2	2008-04-15
Method of making contact pin card system Grant 7,297,563 - Kirby , et al. November 20, 2	2007-11-20
Methods of forming a contact pin assembly Grant 7,287,326 - Kirby , et al. October 30, 2	2007-10-30
Compliant contact pin test assembly and methods thereof Grant 7,288,954 - Kirby , et al. October 30, 2	2007-10-30
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,282,792 - Wark October 16, 2	2007-10-16
Compliant contact pin assembly, card system and methods thereof Grant 7,282,932 - Kirby , et al. October 16, 2	2007-10-16
Selective nickel plating of aluminum, copper, and tungsten structures Grant 7,279,407 - Akram , et al. October 9, 2	2007-10-09
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,265,330 - Farnworth , et al. September 4, 2	2007-09-04
Methods for fabricating and filling conductive vias and conductive vias so formed App 20070184654 - Akram; Salman ; et al.	2007-08-09
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20070170350 - Farnworth; Warren M. ; et al.	2007-07-26
Selective activation of aluminum, copper, and tungsten structures App 20070132105 - Akram; Salman ; et al.	2007-06-14
Projected contact structures for engaging bumped semiconductor devices App 20070132097 - Wark; James M. ; et al.	2007-06-14
Semiconductor component having plate, stacked dice and conductive vias App 20070132104 - Farnworth; Warren M. ; et al.	2007-06-14
Semiconductor component having plate and stacked dice Grant 7,224,051 - Farnworth , et al. May 29, 2	2007-05-29
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers Grant 7,223,626 - Farnworth , et al. May 29, 2	2007-05-29
Method and apparatus for testing bumped die App 20070090855 - Wark; James M.	2007-04-26
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs App 20070088451 - Akram; Salman ; et al.	2007-04-19
Projected contact structures for engaging bumped semiconductor devices and methods of making the same Grant 7,205,661 - Wark , et al. April 17, 2	2007-04-17
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,199,439 - Farnworth , et al. April 3, 2	2007-04-03
Packaged die on PCB with heat sink encapsulant and methods App 20070069372 - Akram; Salman ; et al.	2007-03-29
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20070063229 - Wark; James M.	2007-03-22
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20070063327 - Wark; James M.	2007-03-22
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20070063328 - Wark; James M.	2007-03-22
Method and apparatus for testing bumped die App 20070063722 - Wark; James M.	2007-03-22
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20070063326 - Wark; James M.	2007-03-22
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,189,954 - Farnworth , et al. March 13, 2	2007-03-13
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level App 20070045632 - Oliver; Steven D. ; et al.	2007-03-01
Sloped vias in a substrate, spring-like deflecting contacts, and methods of making App 20070045857 - Wark; James M. ; et al.	2007-03-01
Method of making an interposer with contact structures App 20070017093 - Wark; James M. ; et al.	2007-01-25
Multi-chip module system Grant 7,166,915 - Akram , et al. January 23, 2	2007-01-23
Method of making an interposer with contact structures Grant 7,162,796 - Wark , et al. January 16, 2	2007-01-16
Method of making an interposer with contact structures Grant 7,159,311 - Wark , et al. January 9, 2	2007-01-09
Projected contact structures for engaging bumped semiconductor devices and methods of making the same Grant 7,161,250 - Wark , et al. January 9, 2	2007-01-09
Selective activation of aluminum, copper, and tungsten structures App 20070004200 - Akram; Salman ; et al.	2007-01-04
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 7,155,300 - Akram , et al. December 26, 2	2006-12-26
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts App 20060270108 - Farnworth; Warren M. ; et al.	2006-11-30
Microelectronic imagers and methods of packaging microelectronic imagers App 20060261340 - Farnworth; Warren M. ; et al.	2006-11-23
Device and method for testing integrated circuit dice in an integrated circuit module App 20060244473 - Farnworth; Warren M. ; et al.	2006-11-02
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060243889 - Farnworth; Warren M. ; et al.	2006-11-02
Compliant contact pin test assembly and methods thereof App 20060244475 - Kirby; Kyle K. ; et al.	2006-11-02
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers App 20060234422 - Farnworth; Warren M. ; et al.	2006-10-19
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs Grant 7,120,513 - Akram , et al. October 10, 2	2006-10-10
Methods of making projected contact structures for engaging bumped semiconductor devices Grant 7,115,495 - Wark , et al. October 3, 2	2006-10-03
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 7,109,059 - Wark September 19, 2	2006-09-19
Wafer level methods for fabricating multi-dice chip scale semiconductor components Grant 7,060,526 - Farnworth , et al. June 13, 2	2006-06-13
Semiconductor component having plate and stacked dice App 20060113682 - Farnworth; Warren M. ; et al.	2006-06-01
Hybrid interconnect and system for testing semiconductor dice Grant 7,049,840 - Hembree , et al. May 23, 2	2006-05-23
Device and method for testing integrated circuit dice in an integrated circuit module Grant 7,034,560 - Farnworth , et al. April 25, 2	2006-04-25
Projected contact structures for engaging bumped semiconductor devices and methods of making the same App 20060060968 - Wark; James M. ; et al.	2006-03-23
Projected contact structures for engaging bumped semiconductor devices and methods of making the same App 20060055034 - Wark; James M. ; et al.	2006-03-16
Selective nickel plating of aluminum, copper, and tungsten structures App 20060046088 - Akram; Salman ; et al.	2006-03-02
Sloped vias in a substrate, spring-like deflecting contacts, and methods of making App 20060046475 - Wark; James M. ; et al.	2006-03-02
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers App 20060043512 - Oliver; Steven D. ; et al.	2006-03-02
Interconnect bump plate Grant 7,005,870 - Wark February 28, 2	2006-02-28
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers App 20060040421 - Farnworth; Warren M. ; et al.	2006-02-23
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20060033194 - Wark; James M.	2006-02-16
Multi-dice chip scale semiconductor components Grant 6,998,717 - Farnworth , et al. February 14, 2	2006-02-14
Semiconductor devices with permanent polymer stencil and method for manufacturing the same Grant 6,998,334 - Farnworth , et al. February 14, 2	2006-02-14
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060011809 - Farnworth; Warren M. ; et al.	2006-01-19
Semiconductor devices with permanent polymer stencil and method for manufacturing the same App 20060003569 - Farnworth; Warren M. ; et al.	2006-01-05
Compliant contact pin assembly and card system App 20050275083 - Kirby, Kyle K. ; et al.	2005-12-15
Microelectronic imagers and methods of packaging microelectronic imagers App 20050275048 - Farnworth, Warren M. ; et al.	2005-12-15
Compliant contact pin assembly and card system App 20050275084 - Kirby, Kyle K. ; et al.	2005-12-15
Compliant contact pin assembly and card system App 20050230811 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly and card system App 20050230809 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly and card system App 20050230810 - Kirby, Kyle K. ; et al.	2005-10-20
Methods of forming a contact pin assembly App 20050229393 - Kirby, Kyle K. ; et al.	2005-10-20
Method of making contact pin card system App 20050233482 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly, card system and methods thereof App 20050194180 - Kirby, Kyle K. ; et al.	2005-09-08
Packaged die on PCB with heat sink encapsulant and methods App 20050189646 - Akram, Salman ; et al.	2005-09-01
Method and apparatus for testing bumped die App 20050174134 - Wark, James M.	2005-08-11
Apparatus for testing bumped die Grant 6,927,589 - Wark August 9, 2	2005-08-09
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20050161796 - Wark, James M.	2005-07-28
Apparatus for automatically positioning electronic dice within component packages Grant 6,900,459 - Farnworth , et al. May 31, 2	2005-05-31
Method of making an interposer with contact structures App 20050066523 - Wark, James M. ; et al.	2005-03-31
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 6,869,826 - Wark March 22, 2	2005-03-22
Multi-dice chip scale semiconductor components App 20050046038 - Farnworth, Warren M. ; et al.	2005-03-03
Packaged die on PCB with heat sink encapsulant and methods Grant 6,853,069 - Akram , et al. February 8, 2	2005-02-08
Memory modules including capacity for additional memory Grant 6,841,868 - Akram , et al. January 11, 2	2005-01-11
Multi-dice chip scale semiconductor components and wafer level methods of fabrication Grant 6,841,883 - Farnworth , et al. January 11, 2	2005-01-11
Multi-dice Chip Scale Semiconductor Components And Wafer Level Methods Of Fabrication App 20040256734 - Farnworth, Warren M. ; et al.	2004-12-23
Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip Grant 6,815,817 - Akram , et al. November 9, 2	2004-11-09
Device and method for testing integrated circuit dice in an integrated circuit module Grant 6,801,048 - Farnworth , et al. October 5, 2	2004-10-05
Wafer level methods for fabricating multi-dice chip scale semiconductor components App 20040188819 - Farnworth, Warren M. ; et al.	2004-09-30
Device and method for testing integrated circuit dice in an integrated circuit module App 20040177298 - Farnworth, Warren M. ; et al.	2004-09-09
Method of making an interposer with contact structures Grant 6,782,613 - Wark , et al. August 31, 2	2004-08-31
Multi-chip module system and method of fabrication Grant 6,730,526 - Akram , et al. May 4, 2	2004-05-04
Apparatus providing redundancy for fabricating highly reliable memory modules Grant 6,720,652 - Akram , et al. April 13, 2	2004-04-13
Methods for using an interposer/converter to allow single-sided contact to circuit modules Grant 6,710,614 - Wark March 23, 2	2004-03-23
Packaged die on PCB with heat sink encapsulant and methods App 20040036160 - Akram, Salman ; et al.	2004-02-26
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20040029315 - Wark, James M.	2004-02-12
Method for fabricating interconnect having support members for preventing component flexure Grant 6,687,989 - Farnworth , et al. February 10, 2	2004-02-10
Semiconductor devices with permanent polymer stencil and method for manufacturing the same App 20040005770 - Farnworth, Warren M. ; et al.	2004-01-08
Methods for facilitating circuit board processing Grant 6,655,535 - Wark , et al. December 2, 2	2003-12-02
Projected contact structures for engaging bumped semiconductor devices and methods of making the same App 20030216023 - Wark, James M. ; et al.	2003-11-20
Test carrier with molded interconnect for testing semiconductor components Grant 6,642,730 - Hembree , et al. November 4, 2	2003-11-04
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's undergo, such as additional repairs App 20030191550 - Akram, Salman ; et al.	2003-10-09
Device and method for testing integrated circuit dice in an integrated circuit module App 20030191997 - Farnworth, Warren M. ; et al.	2003-10-09
Apparatus for testing bumped die Grant 6,630,837 - Wark October 7, 2	2003-10-07
Packaged die on PCB with heat sink encapsulant Grant 6,617,684 - Akram , et al. September 9, 2	2003-09-09
Method for making projected contact structures for engaging bumped semiconductor devices Grant 6,613,662 - Wark , et al. September 2, 2	2003-09-02
Device and method for testing integrated circuit dice in an integrated circuit module Grant 6,605,956 - Farnworth , et al. August 12, 2	2003-08-12
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 6,605,489 - Wark August 12, 2	2003-08-12
Force applying probe card and test system for semiconductor wafers Grant 6,600,334 - Hembree , et al. July 29, 2	2003-07-29
Method of making an interposer with contact structures App 20030115752 - Wark, James M. ; et al.	2003-06-26
Method and apparatus for automatically positioning electronic dice within component packages App 20030088973 - Farnworth, Warren M. ; et al.	2003-05-15
Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 6,553,276 - Akram , et al. April 22, 2	2003-04-22
Test carrier with molded interconnect for testing semiconductor components Grant 6,544,461 - Hembree , et al. April 8, 2	2003-04-08
Assembly and methods for packaged die on pcb with heat sink encapsulant Grant 6,534,858 - Akram , et al. March 18, 2	2003-03-18
Electronic system including memory module with redundant memory capability Grant 6,531,772 - Akram , et al. March 11, 2	2003-03-11
Method and apparatus for testing bumped die App 20020196041 - Wark, James M.	2002-12-26
Packaged die on PCB with heat sink encapsulant App 20020195699 - Akram, Salman ; et al.	2002-12-26
Method and apparatus for testing bumped die App 20020185301 - Wark, James M.	2002-12-12
Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip App 20020185748 - Akram, Salman ; et al.	2002-12-12
Method and apparatus providing redundancy for fabricating highly reliable memory modules App 20020185731 - Akram, Salman ; et al.	2002-12-12
Method for automatically positioning electronic die within component packages Grant 6,492,187 - Farnworth , et al. December 10, 2	2002-12-10
Method and apparatus for testing bumped die App 20020158655 - Wark, James M.	2002-10-31
Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice App 20020146862 - Wark, James M.	2002-10-10
Apparatus and method for facilitating circuit board processing App 20020124396 - Wark, James M. ; et al.	2002-09-12
Calibration target for calibrating semiconductor wafer test systems Grant 6,420,892 - Krivy , et al. July 16, 2	2002-07-16
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs App 20020082740 - Akram, Salman ; et al.	2002-06-27
Multi-chip module system and method of fabrication Grant 6,395,565 - Akram , et al. May 28, 2	2002-05-28
Multi-chip module system and method of fabrication App 20020053733 - Akram, Salman ; et al.	2002-05-09
Multi-chip module system and method of fabrication App 20020052054 - Akram, Salman ; et al.	2002-05-02
Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of slip chip Grant 6,376,918 - Akram , et al. April 23, 2	2002-04-23
Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure Grant 6,369,600 - Farnworth , et al. April 9, 2	2002-04-09
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 6,363,295 - Akram , et al. March 26, 2	2002-03-26
Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip App 20020033540 - Akram, Salman ; et al.	2002-03-21
Method and apparatus providing redundancy for fabricating highly reliable memory modules App 20020020914 - Akram, Salman ; et al.	2002-02-21
Thin film capacitor coupons for memory modules and multi-chip modules Grant 6,342,724 - Wark , et al. January 29, 2	2002-01-29
Method for making projected contact structures for engaging bumped semiconductor devices App 20010054771 - Wark, James M. ; et al.	2001-12-27
Memory modules including capacity for additional memory App 20010052637 - Akram, Salman ; et al.	2001-12-20
Test Carrier For Testing Semiconductor Components Including Interconnect With Support Members For Preventing Component Flexure App 20010052785 - FARNWORTH, WARREN M. ; et al.	2001-12-20
Method and apparatus for testing bumped die App 20010048153 - Wark, James M.	2001-12-06
Test Carrier With Molded Interconnect For Testing Semiconductor Components App 20010043074 - HEMBREE, DAVID R. ; et al.	2001-11-22
Method and apparatus for testing bumped die Grant 6,303,993 - Wark October 16, 2	2001-10-16
Electrically conductive elevation shaping tool App 20010027990 - Wark, James M.	2001-10-11
Packaged die on pcb with heat sink encapsulant App 20010015492 - Akram, Salman ; et al.	2001-08-23
Method For Testing Semiconductor Wafers App 20010011899 - FARNWORTH, WARREN M. ; et al.	2001-08-09
Device and method for testing integrated circuit dice in an integrated circuit module App 20010009029 - Farnworth, Warren M. ; et al.	2001-07-19
Packaged die PCB with heat sink encapsulant Grant 6,252,308 - Akram , et al. June 26, 2	2001-06-26
Device and method for testing integrated circuit dice in an integrated circuit module Grant 6,240,535 - Farnworth , et al. May 29, 2	2001-05-29
Calibration target for calibrating semiconductor wafer test systems Grant 6,239,590 - Krivy , et al. May 29, 2	2001-05-29
Electrically conductive elevation shaping tool Grant 6,234,373 - Wark May 22, 2	2001-05-22
Test carrier with variable force applying mechanism for testing semiconductor components App 20010000295 - Farnworth, Warren M. ; et al.	2001-04-19
Method and apparatus providing redundancy for fabricating highly reliable memory modules Grant 6,215,181 - Akram , et al. April 10, 2	2001-04-10
Direct connect interconnect for testing semiconductor dice and wafers Grant 6,204,678 - Akram , et al. March 20, 2	2001-03-20
Method of production an underfill of a bumped or raised die using a barrier adjacent to the sidewall of a semiconductor device Grant 6,194,243 - Akram , et al. February 27, 2	2001-02-27
Thin film capacitor coupons for memory modules and multi-chip modules Grant 6,165,814 - Wark , et al. December 26, 2	2000-12-26
Method and apparatus for testing bumped die Grant 6,140,827 - Wark October 31, 2	2000-10-31
Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 6,140,149 - Wark October 31, 2	2000-10-31
Multi-chip module system Grant 6,087,676 - Akram , et al. July 11, 2	2000-07-11
Force applying probe card and test system for semiconductor wafers Grant 6,078,186 - Hembree , et al. June 20, 2	2000-06-20
Temporary package, and method system for testing semiconductor dice having backside electrodes Grant 6,072,323 - Hembree , et al. June 6, 2	2000-06-06
Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 6,071,754 - Wark June 6, 2	2000-06-06
Apparatus for testing semiconductor wafers Grant 6,064,216 - Farnworth , et al. May 16, 2	2000-05-16
Flip-chip on leads devices Grant 6,060,769 - Wark May 9, 2	2000-05-09
Temporary package, method and system for testing semiconductor dice having backside electrodes Grant 6,060,894 - Hembree , et al. May 9, 2	2000-05-09
Method and apparatus providing redundancy for fabricating highly reliable memory modules Grant 6,060,339 - Akram , et al. May 9, 2	2000-05-09
Semiconductor package with pre-fabricated cover Grant 6,057,597 - Farnworth , et al. May 2, 2	2000-05-02
Hybrid interconnect and system for testing semiconductor dice Grant 6,025,731 - Hembree , et al. February 15, 2	2000-02-15
Direct connect interconnect for testing semiconductor dice and wafers Grant 6,025,730 - Akram , et al. February 15, 2	2000-02-15
Method and apparatus providing redundancy for fabricating highly reliable memory modules Grant 6,008,538 - Akram , et al. December 28, 1	1999-12-28
Interposer converter to allow single-sided contact to circuit modules Grant 6,004,142 - Wark December 21, 1	1999-12-21
Method of using an electrically conductive elevation shaping tool Grant 5,984,164 - Wark November 16, 1	1999-11-16
Thin film capacitor coupons for memory modules and multi-chip modules Grant 5,982,018 - Wark , et al. November 9, 1	1999-11-09
Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 5,973,403 - Wark October 26, 1	1999-10-26
Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device Grant 5,973,404 - Akram , et al. October 26, 1	1999-10-26
Method and apparatus for automatically positioning electronic dice within component packages Grant 5,955,877 - Farnworth , et al. September 21, 1	1999-09-21
Apparatus for testing semiconductor wafers Grant 5,952,840 - Farnworth , et al. September 14, 1	1999-09-14
Interconnect for making temporary electrical connections with bumped semiconductor components Grant 5,931,685 - Hembree , et al. August 3, 1	1999-08-03
Projected contact structure for bumped semiconductor device and resulting articles and assemblies Grant 5,929,521 - Wark , et al. July 27, 1	1999-07-27
System and interconnect for making temporary electrical connections with bumped semiconductor components Grant 5,915,977 - Hembree , et al. June 29, 1	1999-06-29
Apparatus and method for facilitating circuit board processing Grant 5,911,329 - Wark , et al. June 15, 1	1999-06-15
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 5,907,492 - Akram , et al. May 25, 1	1999-05-25
Semiconductor package with pre-fabricated cover and method of fabrication Grant 5,893,726 - Farnworth , et al. April 13, 1	1999-04-13
Method and apparatus for automatically positioning electronic dice within component packages Grant 5,894,218 - Farnworth , et al. April 13, 1	1999-04-13
Packaged die on PCB with heat sink encapsulant Grant 5,866,953 - Akram , et al. February 2, 1	1999-02-02
Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same Grant 5,847,445 - Wark , et al. December 8, 1	1998-12-08
Method of fabricating flip-chip on leads devices and resulting assemblies Grant 5,817,540 - Wark October 6, 1	1998-10-06
Apparatus for reducing damage to wafer cutting blades during wafer dicing Grant 5,809,987 - Wark , et al. September 22, 1	1998-09-22
Multi-chip module system and method of fabrication Grant 5,807,762 - Akram , et al. September 15, 1	1998-09-15
Device and method for testing integrated circuit dice in an integrated circuit module Grant 5,796,746 - Farnworth , et al. August 18, 1	1998-08-18
Method and apparatus for underfill of bumped or raised die Grant 5,766,982 - Akram , et al. June 16, 1	1998-06-16
Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Grant 5,696,031 - Wark December 9, 1	1997-12-09