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Patent applications and USPTO patent grants for Warfield; Timothy J..The latest application filed is for "method for packaging semiconductor devices".
Patent | Date |
---|---|
Method for packaging semiconductor devices Grant 5,604,160 - Warfield February 18, 1 | 1997-02-18 |
Method for forming a planarization etch stop Grant 5,512,163 - Warfield April 30, 1 | 1996-04-30 |
Method for roughening surface of halocarbon film Grant 5,411,629 - Warfield May 2, 1 | 1995-05-02 |
Method of cleaning a semiconductor wafer Grant 5,232,563 - Warfield August 3, 1 | 1993-08-03 |
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