Wardwell; Robert H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wardwell; Robert H..The latest application filed is for "methods of making a interconnect".
- Wardwell; Robert H. - Colorado Springs CO
| Patent | Date |
|---|---|
| Methods Of Making A Interconnect App 20060281342 - Self; Bob J. ; et al. | 2006-12-14 |
| High density interconnect Grant 7,094,063 - Self , et al. August 22, 2 | 2006-08-22 |
| High density, high frequency, board edge probe Grant 6,864,696 - Logelin , et al. March 8, 2 | 2005-03-08 |
| Discrete connector termination adapter Grant 6,776,662 - Self , et al. August 17, 2 | 2004-08-17 |
| High density, high frequency, board edge probe App 20040085081 - Logelin, Donald M. ; et al. | 2004-05-06 |
| Connector Termination Adapter App 20040063342 - Self, Bob J. ; et al. | 2004-04-01 |
| Discrete connector termination adapter App 20040063356 - Self, Bob J. ; et al. | 2004-04-01 |
| Connector termination adapter Grant 6,712,622 - Self , et al. March 30, 2 | 2004-03-30 |
| High density interconnect App 20040043640 - Self, Bob J. ; et al. | 2004-03-04 |
| Portable wedge probe for perusing signals on the pins of an IC Grant 5,923,177 - Wardwell July 13, 1 | 1999-07-13 |
| Connecting test equipment to adjacent legs of an IC or the like by interdigitating conductive wedges with the legs Grant 5,701,086 - Wardwell December 23, 1 | 1997-12-23 |
| Wedge connector for integrated circuits Grant 5,507,652 - Wardwell April 16, 1 | 1996-04-16 |
| Probe with contacts that interdigitate with and wedge between adjacent legs of an IC or the like Grant 5,463,324 - Wardwell , et al. October 31, 1 | 1995-10-31 |
| Connector assembly for testing integrated circuit packages Grant 5,205,741 - Steen , et al. April 27, 1 | 1993-04-27 |
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