Ward; William C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ward; William C..The latest application filed is for "alkali metal borate and lubricating compositions thereof".

Company Profile

0.13.4

Ward; William C. - Perry OH US
Ward; William C. - Santa Fe NM
Ward; William C. - Burlington VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition containing heterocyclic compounds and a method of lubricating an internal combustion engine Grant 8,785,357 - Mosier , et al. July 22, 2	2014-07-22
Alkali metal borate and lubricating compositions thereof Grant 8,410,030 - Ward , et al. April 2, 2	2013-04-02
Alkali Metal Borate and Lubricating Compositions Thereof App 20120214716 - Ward; William C. ; et al.	2012-08-23
Alkali metal borate and lubricating compositions thereof Grant 8,193,130 - Ward , et al. June 5, 2	2012-06-05
Composition Containing Heterocyclic Compounds and a Method of Lubricating an Internal Combustion Engine App 20110190180 - Mosier; Patrick E. ; et al.	2011-08-04
Alkali Metal Borate and Lubricating Compositions Thereof App 20100113312 - Ward; William C. ; et al.	2010-05-06
Lubricants That Decrease Micropitting for Industrial Gears App 20090093384 - Ward; William C. ; et al.	2009-04-09
Method and apparatus for adapting steady flow with cyclic thermodynamics Grant 6,164,073 - Swift , et al. December 26, 2	2000-12-26
Semiconductor package with ground plane Grant 4,965,654 - Karner , et al. October 23, 1	1990-10-23
Method of bonding gold or gold alloy wire to lead tin solder Grant 4,907,734 - Conru , et al. March 13, 1	1990-03-13
Heat dissipation package for integrated circuits Grant 4,878,108 - Phelps, Jr. , et al. October 31, 1	1989-10-31
Package semiconductor chip Grant 4,862,245 - Pashby , et al. August 29, 1	1989-08-29
Peripheral/area wire bonding technique Grant 4,796,078 - Phelps, Jr. , et al. January 3, 1	1989-01-03
Substrate with multiple type connections Grant 4,447,857 - Marks , et al. May 8, 1	1984-05-08
Integrated Circuit Chip Repair Tool Grant 3,735,911 - Ward May 29, 1	1973-05-29

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