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Device and method for wireless transmission
Grant 11,323,143 - Tong , et al. May 3, 2 | 2022-05-03 |
Wavelength-modulable spectrum generator, and system and method for measuring concentration of gas component based thereon
Grant 11,137,346 - Tang , et al. October 5, 2 | 2021-10-05 |
Encapsulation structure of image sensing chip, and encapsulation method therefor
Grant 11,049,899 - Wang , et al. June 29, 2 | 2021-06-29 |
Packaging Method And Packaging Structure For Semiconductor Chip
App 20200395399 - Wang; Zhiqi ; et al. | 2020-12-17 |
Wavelength-modulable Spectrum Generator, And System And Method For Measuring Concentration Of Gas Component Based Thereon
App 20200363324 - Tang; Dedong ; et al. | 2020-11-19 |
Optical fingerprint recognition chip package and packaging method
Grant 10,817,700 - Wang , et al. October 27, 2 | 2020-10-27 |
Encapsulation Structure Of Image Sensing Chip, And Encapsulation Method Therefor
App 20200303448 - Wang; Zhiqi ; et al. | 2020-09-24 |
Image sensing chip package and image sensing chip packaging method
Grant 10,763,293 - Wang Sep | 2020-09-01 |
Packaging Structure And Packaging Method
App 20200243588 - Wang; Zhiqi ; et al. | 2020-07-30 |
Optical Fingerprint Recognition Chip Package And Packaging Method
App 20200234028 - Wang; Zhiqi ; et al. | 2020-07-23 |
Semiconductor device and manufacture method of the same
Grant 10,685,917 - Wang | 2020-06-16 |
Chip packaging method and chip package
Grant 10,680,033 - Wang | 2020-06-09 |
Negotiation mode processing method and intelligent network device
Grant 10,659,297 - Liu , et al. | 2020-05-19 |
Fingerprint Chip Packaging Method And Fingerprint Chip Package
App 20200051938 - Wang; Zhiqi | 2020-02-13 |
Image sensing chip packaging structure and packaging method
Grant 10,541,262 - Wang , et al. Ja | 2020-01-21 |
Chip package and chip packaging method
Grant 10,541,186 - Wang , et al. Ja | 2020-01-21 |
Package-on-package structure and package-on-package method
Grant 10,541,264 - Wang Ja | 2020-01-21 |
Packaging method and packaging structure
Grant 10,529,758 - Wang , et al. J | 2020-01-07 |
Fingerprint sensing chip packaging method and fingerprint sensing chip package
Grant 10,497,728 - Wang , et al. De | 2019-12-03 |
Packaging structure and packaging method
Grant 10,490,583 - Wang , et al. Nov | 2019-11-26 |
Packaging Method And Packaging Structure For Semiconductor Chip
App 20190296064 - Wang; Zhiqi ; et al. | 2019-09-26 |
Semiconductor chip package structure and packaging method therefor
Grant 10,418,296 - Wang , et al. Sept | 2019-09-17 |
Packaging Structure And Packaging Method
App 20190259634 - Wang; Zhiqi ; et al. | 2019-08-22 |
Semiconductor Device And Manufacture Method Of The Same
App 20190206801 - Wang; Zhiqi | 2019-07-04 |
Chip Package And Chip Packaging Method
App 20190202685 - Wang; Zhiqi | 2019-07-04 |
Optical Fingerprint Recognition Chip Package And Packaging Method
App 20190188447 - Wang; Zhiqi ; et al. | 2019-06-20 |
Chip Packaging Method And Chip Package
App 20190189675 - Wang; Zhiqi | 2019-06-20 |
Fingerprint Chip Packaging Method And Fingerprint Chip Package
App 20190189578 - Wang; Zhiqi | 2019-06-20 |
Packaging method and package structure for image sensing chip
Grant 10,325,946 - Wang , et al. | 2019-06-18 |
Package For Iris Recognition Imaging Module And Manufacturing Method Thereof
App 20190165013 - Wang; Zhiqi ; et al. | 2019-05-30 |
Image Sensing Chip Package And Image Sensing Chip Packaging Method
App 20190165030 - Wang; Zhiqi | 2019-05-30 |
Package-on-package Structure And Package-on-package Method
App 20190165028 - Wang; Zhiqi | 2019-05-30 |
Packaging method and package structure for image sensing chip
Grant 10,283,483 - Wang , et al. | 2019-05-07 |
Chip packaging method and chip packaging structure
Grant 10,276,540 - Wang , et al. | 2019-04-30 |
Solder Pad, Semiconductor Chip Comprising Solder Pad, And Forming Method Therefor
App 20190074258 - Wang; Zhiqi ; et al. | 2019-03-07 |
Image Sensing Chip Packaging Structure And Packaging Method
App 20190074309 - Wang; Zhiqi ; et al. | 2019-03-07 |
Photosensitive Chip Packaging Structure And Packaging Method Thereof
App 20190067352 - Wang; Zhiqi ; et al. | 2019-02-28 |
Packaging Method And Package Structure For Fingerprint Recognition Chip And Drive Chip
App 20190013302 - Wang; Zhiqi ; et al. | 2019-01-10 |
Packaging Structure And Packaging Method Of Mems Chip And Asic Chip
App 20190010046 - Wang; Zhiqi | 2019-01-10 |
Packaging Structure And Packaging Method
App 20190006404 - Wang; Zhiqi ; et al. | 2019-01-03 |
Semiconductor Chip Package Structure And Packaging Method Therefor
App 20190006253 - Wang; Zhiqi ; et al. | 2019-01-03 |
Chip Package And Chip Packaging Method
App 20180366387 - Wang; Zhiqi ; et al. | 2018-12-20 |
Package Structure And Packaging Method
App 20180337206 - Wang; Zhiqi ; et al. | 2018-11-22 |
Fingerprint recognition chip packaging structure and packaging method
Grant 10,133,907 - Wang , et al. November 20, 2 | 2018-11-20 |
Wafer-level chip package structure and packaging method
Grant 10,126,151 - Wang , et al. November 13, 2 | 2018-11-13 |
Image Sensing Chip Packaging Structure And Packaging Method Therefor
App 20180308890 - Wang; Zhiqi ; et al. | 2018-10-25 |
Fingerprint recognition chip packaging structure and packaging method
Grant 10,108,837 - Wang , et al. October 23, 2 | 2018-10-23 |
Image Sensing Chip Packaging Structure And Packaging Method
App 20180301488 - Wang; Zhiqi ; et al. | 2018-10-18 |
Packaging Method And Package Structure For Image Sensing Chip
App 20180301434 - Wang; Zhiqi ; et al. | 2018-10-18 |
Image Sensing Chip Packaging Structure And Method
App 20180294302 - Wang; Zhiqi ; et al. | 2018-10-11 |
Fingerprint recognition chip packaging structure and packaging method
Grant 10,096,643 - Wang , et al. October 9, 2 | 2018-10-09 |
Packaging Method And Package Structure For Image Sensing Chip
App 20180286903 - Wang; Zhiqi ; et al. | 2018-10-04 |
Chip packaging method and package structure
Grant 10,090,217 - Wang , et al. October 2, 2 | 2018-10-02 |
Image Sensor Package Structure And Packaging Method Thereof
App 20180247962 - Wang; Zhiqi ; et al. | 2018-08-30 |
Package Structure And Packaging Method
App 20180240827 - Wang; Zhiqi ; et al. | 2018-08-23 |
Negotiation Mode Processing Method and Intelligent Network Device
App 20180219732 - Liu; Fei ; et al. | 2018-08-02 |
Fingerprint Sensing Chip Packaging Method And Fingerprint Sensing Chip Package
App 20180145102 - Wang; Zhiqi ; et al. | 2018-05-24 |
Chip Packaging Structure And Packaging Method
App 20180129848 - Wang; Zhiqi ; et al. | 2018-05-10 |
Chip Packaging Method And Chip Packaging Structure
App 20180114048 - Wang; Zhiqi ; et al. | 2018-04-26 |
Chip Packaging Structure And Packaging Method
App 20180108585 - Wang; Zhiqi ; et al. | 2018-04-19 |
Image Sensor Package And Method Of Packaging The Same
App 20180090524 - Wang; Zhiqi | 2018-03-29 |
Chip Packaging Method And Chip Packaging Structure
App 20180068977 - Wang; Zhiqi ; et al. | 2018-03-08 |
Packaging Method And Packaging Structure
App 20180047772 - Wang; Zhiqi ; et al. | 2018-02-15 |
Chip Packaging Method And Package Structure
App 20170287797 - Wang; Zhiqi ; et al. | 2017-10-05 |
Wafer-level Chip Package Structure And Packaging Method
App 20170284837 - Wang; Zhiqi ; et al. | 2017-10-05 |
Chip to wafer package with top electrodes and method of forming
Grant 9,748,162 - Wang , et al. August 29, 2 | 2017-08-29 |
Fingerprint Recognition Chip Packaging Structure And Packaging Method
App 20170162620 - WANG; Zhiqi ; et al. | 2017-06-08 |
Fingerprint Recognition Chip Packaging Structure And Packaging Method
App 20170147851 - Wang; Zhiqi ; et al. | 2017-05-25 |
Fingerprint Recognition Chip Packaging Structure And Packaging Method
App 20170140195 - Wang; Zhiqi ; et al. | 2017-05-18 |
Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions
Grant 9,601,531 - Wang , et al. March 21, 2 | 2017-03-21 |
Image sensor package structure and method
Grant 9,299,735 - Wang , et al. March 29, 2 | 2016-03-29 |
Wafer level packaging structure for image sensors and wafer level packaging method for image sensors
Grant 9,231,018 - Wang , et al. January 5, 2 | 2016-01-05 |
Chip Package And Method For Forming The Same
App 20150200153 - Wang; Zhiqi ; et al. | 2015-07-16 |
Image Sensor Package Structure And Method
App 20150137294 - Wang; Zhiqi ; et al. | 2015-05-21 |
Wafer Level Packaging Structure For Image Sensors And Wafer Level Packaging Method For Image Sensors
App 20150054109 - Wang; Zhiqi ; et al. | 2015-02-26 |
Wafer Level Packaging Structure For Image Sensors And Wafer Level Packaging Method For Image Sensors
App 20150054108 - Wang; Zhiqi ; et al. | 2015-02-26 |
Amplifier device and predistortion control method
Grant 8,472,556 - Shi , et al. June 25, 2 | 2013-06-25 |
Adaptive digital predistortion device and method
Grant 8,421,533 - Sun , et al. April 16, 2 | 2013-04-16 |
Packaging structure
Grant 8,174,090 - Wang , et al. May 8, 2 | 2012-05-08 |
Adaptive Digital Predistortion Device and Method
App 20110187455 - Sun; Gang ; et al. | 2011-08-04 |
Amplifier Device and Predistortion Control Method
App 20110068868 - Shi; Zhan ; et al. | 2011-03-24 |
Wafer level chip size package for MEMS devices and method for fabricating the same
Grant 7,781,250 - Wang , et al. August 24, 2 | 2010-08-24 |
Packaging structure and method for fabricating the same
Grant 7,755,155 - Yu , et al. July 13, 2 | 2010-07-13 |
Optical Converter And Manufacturing Method Thereof And Light Emitting Diode
App 20100171134 - Shao; Mingda ; et al. | 2010-07-08 |
Packaging Method And Packaging Structure
App 20100133640 - Wang; Zhiqi ; et al. | 2010-06-03 |
Packaging Structure, Packaging Method And Photosensitive Device
App 20100065956 - WANG; Zhiqi ; et al. | 2010-03-18 |
Packaging Structure And Method For Fabricating The Same
App 20090289317 - YU; Guoping ; et al. | 2009-11-26 |
Wafer Level Chip Size Package For MEMS Devices And Method For Fabricating The Same
App 20090057868 - Wang; Zhiqi ; et al. | 2009-03-05 |
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