Wang; Zhi-Jie
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Zhi-Jie.The latest application filed is for "method of forming a semiconductor package and structure thereof".
- Wang; Zhi-Jie - Shanghai CN
- Wang; Zhi-jie - Tianjin CN
- Wang; Zhi-Jie - Arcadia CA
Trademarks
| Patent | Date |
|---|---|
| Bending an edge portion of a housing panel Grant 9,481,020 - Wang , et al. November 1, 2 | 2016-11-01 |
| Method of forming a semiconductor package and structure thereof Grant 8,138,584 - Wang , et al. March 20, 2 | 2012-03-20 |
| Method Of Forming A Semiconductor Package And Structure Thereof App 20090184403 - Wang; Zhi-Jie ; et al. | 2009-07-23 |
| Lead Frame For Semiconductor Device App 20080290487 - ZHAO; Li-Guo ; et al. | 2008-11-27 |
| Lead Frame For Semiconductor Package App 20080283980 - Gao; Wei ; et al. | 2008-11-20 |
| QFN package and method therefor App 20060038266 - Song; Fu-Bin ; et al. | 2006-02-23 |
| Buried hetero-structure opto-electronic device Grant 6,727,112 - Wang , et al. April 27, 2 | 2004-04-27 |
| Buried hetero-structure opto-electronic device App 20020074600 - Wang, Zhi-Jie ; et al. | 2002-06-20 |
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