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name:-0.038563013076782
name:-0.020896911621094
name:-0.00041389465332031
WANG; Yung-Hui Patent Filings

WANG; Yung-Hui

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; Yung-Hui.The latest application filed is for "optical communication package structure and method for manufacturing the same".

Company Profile
0.19.33
  • WANG; Yung-Hui - Kaohsiung TW
  • Wang; Yung-Hui - Kaohsiung City TW
  • Wang; Yung-Hui - Jiali Township, Tainan County N/A TW
  • Wang; Yung-Hui - Jiali Township TW
  • WANG; Yung-Hui - Taipei City TW
  • Wang; Yung-Hui - TAIPEI TW
  • Wang; Yung-Hui - Taipei Hsien TW
  • Wang; Yung-Hui - Hsin-Tien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optical Communication Package Structure And Method For Manufacturing The Same
App 20220236480 - WU; Cheng-Hsuan ;   et al.
2022-07-28
Optical communication package structure and method for manufacturing the same
Grant 11,300,727 - Wu , et al. April 12, 2
2022-04-12
Optical Communication Package Structure And Method For Manufacturing The Same
App 20210033785 - WU; Cheng-Hsuan ;   et al.
2021-02-04
Semiconductor Wafer, Semiconductor Package And Method For Manufacturing The Same
App 20180122749 - LEE; Ying-Chih ;   et al.
2018-05-03
Fabrication method of embedded chip substrate
Grant 9,768,103 - Wang , et al. September 19, 2
2017-09-19
Fabrication Method Of Embedded Chip Substrate
App 20160118325 - WANG; Yung-Hui ;   et al.
2016-04-28
Fabrication method of embedded chip substrate
Grant 9,253,887 - Wang , et al. February 2, 2
2016-02-02
Semiconductor wafer, semiconductor process and semiconductor package
Grant 8,987,734 - Wang March 24, 2
2015-03-24
Semiconductor Wafer, Semiconductor Process And Semiconductor Package
App 20140264716 - Wang; Yung-Hui
2014-09-18
Closure device for drain pipeline
Grant 8,528,128 - Wang September 10, 2
2013-09-10
Fabrication Method Of Embedded Chip Substrate
App 20120295403 - Wang; Yung-Hui ;   et al.
2012-11-22
Closure Device for Drain Pipeline
App 20120117721 - Wang; Yung-Hui
2012-05-17
Method for manufacturing a circuit board having an embedded component therein
Grant 8,099,865 - Wang , et al. January 24, 2
2012-01-24
Carrier with embedded component and method for fabricating the same
Grant 8,000,107 - Wang , et al. August 16, 2
2011-08-16
Closed-air Cushioned Key Switch Structure
App 20110036701 - WANG; Yung-Hui
2011-02-17
Embedded Chip Substrate And Fabrication Method Thereof
App 20100018761 - WANG; YUNG-HUI ;   et al.
2010-01-28
Structure And Process Of Embedded Chip Package
App 20100006330 - Fu; Chieh-Chen ;   et al.
2010-01-14
Method For Manufacturing A Circuit Board Having An Embedded Component Therein
App 20090249618 - WANG; Yung Hui ;   et al.
2009-10-08
Electronic package
Grant 7,586,184 - Hung , et al. September 8, 2
2009-09-08
Manufacturing method of a multi-layer circuit board embedded with a passive component
Grant 7,523,551 - Horng , et al. April 28, 2
2009-04-28
Manufacturing method of a multi-layer circuit board with an embedded passive component
Grant 7,506,435 - Hung , et al. March 24, 2
2009-03-24
Carrier with embedded component and method for fabricating the same
App 20080273313 - Wang; Yung-Hui ;   et al.
2008-11-06
Semiconductor Package Structure With Buried Electronic Device And Manufacturing Method Therof
App 20080212287 - Shih; Che-Kun ;   et al.
2008-09-04
Package Structure With Embedded Capacitor, Fabricating Process Thereof And Applications Of The Same
App 20080180878 - Wang; Yung-Hui ;   et al.
2008-07-31
Substrate With Embedded Passive Element And Methods For Manufacturing The Same
App 20080164562 - Wang; Yung-Hui ;   et al.
2008-07-10
Electronic Package
App 20080145589 - Hung; Chih Pin ;   et al.
2008-06-19
Circuit carrier and manufacturing process thereof
Grant 7,338,892 - Wang , et al. March 4, 2
2008-03-04
Remote Controller
App 20080012723 - Wang; Yung-Hui
2008-01-17
Circuit Carrier And Manufacturing Process Thereof
App 20070287281 - Wang; Yung-Hui ;   et al.
2007-12-13
Method For Fabricating Identification Code
App 20070220742 - Lo; Kuang-Lin ;   et al.
2007-09-27
Wireless portable input device and receiver of the same
Grant 7,187,361 - Wang March 6, 2
2007-03-06
Wireless Input Device
App 20060244726 - Wang; Yung-Hui ;   et al.
2006-11-02
Manufacturing method of a multi-layer circuit board embedded with a passive component
App 20060059682 - Horng; Ching-Fu ;   et al.
2006-03-23
Manufacturing method of a multi-layer circuit board with an embedded passive component
App 20060063301 - Hung; Ching-Fu ;   et al.
2006-03-23
Thin switch
Grant 7,012,208 - Wang March 14, 2
2006-03-14
Manufacturing method of a multi-layer circuit board with an embedded passive component
App 20060005384 - Hung; Ching-Fu ;   et al.
2006-01-12
Method for forming printed circuit board
App 20050251997 - Homg, Ching-Fuq ;   et al.
2005-11-17
Auto-switching channel method of unidirectional wireless receiver
App 20050174976 - Wang, Yung-Hui
2005-08-11
Wireless input device
Grant 6,909,421 - Wang June 21, 2
2005-06-21
Thin switch
App 20050126900 - Wang, Yung-Hui
2005-06-16
Wireless portable input device and receiver of the same
App 20050073499 - Wang, Yung-Hui
2005-04-07
[ball-actuated Optical Mouse]
App 20050057511 - Wang, Yung-Hui
2005-03-17
Structure of button for electronic product
Grant 6,861,603 - Wang March 1, 2
2005-03-01
[auto-control Device And Method Of Remotely Controlling Electronic Appliances]
App 20050040966 - Wang, Yung-Hui
2005-02-24
[optical Mouse]
App 20050035946 - Wang, Yung-Hui
2005-02-17
Rocker switch
Grant 6,797,905 - Wang , et al. September 28, 2
2004-09-28
Signal adaptor for USB and PS/2 connector
App 20040185719 - Wang, Yung-Hui
2004-09-23
Receiver with wireless input device
App 20040147292 - Wang, Yung-Hui
2004-07-29
Tact switch
Grant 6,670,566 - Wang December 30, 2
2003-12-30
Wireless input device
App 20030179177 - Wang, Yung-Hui
2003-09-25

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