Wang; Yunda
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Yunda.The latest application filed is for "polymer-based microfabricated thermal ground plane".
- Wang; Yunda - Milpitas CA
- Wang; Yunda - Denver CO
| Patent | Date |
|---|---|
| Method and system for assembly of micro-LEDs onto a substrate Grant 11,348,905 - Wang , et al. May 31, 2 | 2022-05-31 |
| Polymer-based Microfabricated Thermal Ground Plane App 20220155025 - Lewis; Ryan John ; et al. | 2022-05-19 |
| Transfer elements that selectably hold and release objects based on changes in stiffness Grant 11,302,561 - Wang , et al. April 12, 2 | 2022-04-12 |
| Method And System For Assembly Of Micro-leds Onto A Substrate App 20210272935 - Wang; Yunda ; et al. | 2021-09-02 |
| Transfer Elements that Selectably Hold and Release Objects Based on Changes in Stiffness App 20210143045 - Wang; Yunda ; et al. | 2021-05-13 |
| Transfer substrate utilizing selectable surface adhesion transfer elements Grant 10,964,582 - Wang , et al. March 30, 2 | 2021-03-30 |
| Thermal Insulation And Temperature Control Of Components App 20210076484 - Wang; Yunda | 2021-03-11 |
| Thermal insulation and temperature control of components Grant 10,917,963 - Wang February 9, 2 | 2021-02-09 |
| Transfer Substrate Utilizing Selectable Surface Adhesion Transfer Elements App 20200402831 - Wang; Yunda ; et al. | 2020-12-24 |
| High Registration Particles-transferring System App 20200173026 - Wang; Yunda ; et al. | 2020-06-04 |
| High registration particles-transferring system Grant 10,604,843 - Wang , et al. | 2020-03-31 |
| Thermal Insulation And Temperature Control Of Components App 20200008294 - Wang; Yunda | 2020-01-02 |
| Polymer-based Microfabricated Thermal Ground Plane App 20190390919 - Lewis; Ryan John ; et al. | 2019-12-26 |
| Thermal insulation and temperature control of components Grant 10,470,292 - Wang No | 2019-11-05 |
| Multilayer capacitor Grant 10,460,878 - Wang , et al. Oc | 2019-10-29 |
| Multilayer capacitor Grant 10,403,439 - Wang , et al. Sep | 2019-09-03 |
| Multilayer Capacitor App 20190122825 - Wang; Yunda ; et al. | 2019-04-25 |
| Thermal Insulation And Temperature Control Of Components App 20190069390 - Wang; Yunda | 2019-02-28 |
| High Registration Particles-transferring System App 20180327905 - Wang; Yunda ; et al. | 2018-11-15 |
| Electrocaloric System App 20180164001 - Schwartz; David E. ; et al. | 2018-06-14 |
| Mechanical Heat Switch And Method App 20180114659 - SCHWARTZ; David Eric ; et al. | 2018-04-26 |
| Printed level sensor Grant 9,952,082 - Schwartz , et al. April 24, 2 | 2018-04-24 |
| Polymer-based microfabricated thermal ground plane Grant 9,921,004 - Lewis , et al. March 20, 2 | 2018-03-20 |
| Printed Level Sensor App 20170328761 - Schwartz; David E. ; et al. | 2017-11-16 |
| Multilayer Capacitor App 20170178819 - Wang; Yunda ; et al. | 2017-06-22 |
| Polymer-based Microfabricated Thermal Ground Plane App 20160161193 - Lewis; Ryan John ; et al. | 2016-06-09 |
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