Wang; Yu-Shih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Yu-Shih.The latest application filed is for "conductive feature of a semiconductor device and method of forming same".
Company Profile
18.27.42
- Wang; Yu-Shih - Tainan City TW
- Wang; Yu Shih - Tainan TW
- Wang; Yu-Shih - New Taipei City TW
- Wang; Yu-Shih - New Taipei TW
- Wang; Yu-Shih - ChungHo TW
- Wang, Yu-Shih - Chung Ho City TW
Patent Activity
| Patent | Date |
|---|---|
| Conductive Feature of a Semiconductor Device and Method of Forming Same App 20220285209 - Chiu; U-Ting ; et al. | 2022-09-08 |
| Semiconductor device and manufacturing method thereof Grant 11,424,185 - Chang , et al. August 23, 2 | 2022-08-23 |
| Electronic Device Assembly App 20220236766 - Wang; Yu-Shih ; et al. | 2022-07-28 |
| Substrate processing apparatus and method for processing substrate Grant 11,398,391 - Wang , et al. July 26, 2 | 2022-07-26 |
| Touch Pad Structure App 20220206600 - Wang; Yu-Shih ; et al. | 2022-06-30 |
| Method Of Breaking Through Etch Stop Layer App 20220172945 - Wang; Yu-Shih ; et al. | 2022-06-02 |
| Electronic device Grant 11,340,659 - Wang , et al. May 24, 2 | 2022-05-24 |
| Electronic device assembly Grant 11,334,115 - Wang , et al. May 17, 2 | 2022-05-17 |
| Touch pad structure Grant 11,314,343 - Wang , et al. April 26, 2 | 2022-04-26 |
| Contact structure and method of fabricating the same Grant 11,282,750 - Hsu , et al. March 22, 2 | 2022-03-22 |
| Plug Electrical Connector And Receptacle Electrical Connector App 20220085550 - Wang; Yu-Shih ; et al. | 2022-03-17 |
| Method of breaking through etch stop layer Grant 11,276,571 - Wang , et al. March 15, 2 | 2022-03-15 |
| Heat dissipation fan Grant 11,268,525 - Lin , et al. March 8, 2 | 2022-03-08 |
| Connecting Structure And Method For Forming The Same App 20220051982 - CHIU; U-TING ; et al. | 2022-02-17 |
| Button Structure Of Input Device App 20210398758 - Wang; Yu-Shih ; et al. | 2021-12-23 |
| Semiconductor device and method of forming same Grant 11,195,752 - Wang , et al. December 7, 2 | 2021-12-07 |
| Semiconductor Device And Method Of Forming Same App 20210375677 - Wang; Yu Shih ; et al. | 2021-12-02 |
| Substrate Processing Apparatus And Method For Processing Substrate App 20210366737 - WANG; PO-YUAN ; et al. | 2021-11-25 |
| Method for forming semiconductor device that includes covering metal gate with multilayer dielectric Grant 11,164,789 - Ho , et al. November 2, 2 | 2021-11-02 |
| Touch Pad Structure App 20210333898 - Wang; Yu-Shih ; et al. | 2021-10-28 |
| Electronic device Grant 11,157,046 - Pai , et al. October 26, 2 | 2021-10-26 |
| Method For Forming Semiconductor Device That Includes Covering Metal Gate With Multilayer Dielectric App 20210327760 - HO; Tsai-Jung ; et al. | 2021-10-21 |
| Expansion device Grant 11,146,031 - Pai , et al. October 12, 2 | 2021-10-12 |
| Conductive Feature Formation and Structure App 20210225701 - Wang; Yu Shih ; et al. | 2021-07-22 |
| Electronic Device Assembly App 20210223821 - Wang; Yu-Shih ; et al. | 2021-07-22 |
| Electronic Device App 20210208635 - Wang; Yu-Shih ; et al. | 2021-07-08 |
| Semiconductor Device And Manufacturing Method Thereof App 20210202399 - CHANG; Cheng-Wei ; et al. | 2021-07-01 |
| Semiconductor Device and Method App 20210202305 - Yeh; Po-Nan ; et al. | 2021-07-01 |
| Method Of Breaking Through Etch Stop Layer App 20210202238 - Wang; Yu Shih ; et al. | 2021-07-01 |
| Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition App 20210193517 - Chen; Pin-Wen ; et al. | 2021-06-24 |
| Touch pad structure Grant 11,009,974 - Pai , et al. May 18, 2 | 2021-05-18 |
| Semiconductor Device and Method of Manufacture App 20210134660 - Wang; Yu Shih ; et al. | 2021-05-06 |
| Wet Cleaning with Tunable Metal Recess for Via Plugs App 20210134662 - Wang; Yu Shih ; et al. | 2021-05-06 |
| Conductive feature formation and structure Grant 10,971,396 - Wang , et al. April 6, 2 | 2021-04-06 |
| Electronic Device App 20210055762 - PAI; Ting-Wen ; et al. | 2021-02-25 |
| Touch Pad Structure App 20210011565 - Pai; Ting-Wen ; et al. | 2021-01-14 |
| Plug connector Grant 10,879,656 - Wang , et al. December 29, 2 | 2020-12-29 |
| Contact Structure and Method of Fabricating the Same App 20200402859 - Hsu; Wan Hsuan ; et al. | 2020-12-24 |
| Wet cleaning with tunable metal recess for VIA plugs Grant 10,867,844 - Wang , et al. December 15, 2 | 2020-12-15 |
| Expansion Device App 20200335924 - Pai; Ting-Wen ; et al. | 2020-10-22 |
| Contact structure and method of fabricating the same Grant 10,770,356 - Hsu , et al. Sep | 2020-09-08 |
| Plug Connector App 20200274305 - Wang; Yu-Shih ; et al. | 2020-08-27 |
| Heat Dissipation Fan App 20200191157 - Lin; Yu-Ming ; et al. | 2020-06-18 |
| Conductive feature formation and structure using bottom-up filling deposition Grant 10,475,702 - Chen , et al. Nov | 2019-11-12 |
| Wet Cleaning with Tunable Metal Recess for VIA Plugs App 20190304834 - Wang; Yu Shih ; et al. | 2019-10-03 |
| Electric connector for electronic device Grant 10,431,937 - Wang , et al. O | 2019-10-01 |
| Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition App 20190287851 - CHEN; Pin-Wen ; et al. | 2019-09-19 |
| Conductive feature formation and structure Grant 10,361,120 - Wang , et al. | 2019-07-23 |
| Conductive Feature Formation And Structure App 20190164823 - WANG; Yu Shih ; et al. | 2019-05-30 |
| Conductive Feature Formation and Structure App 20190164824 - Wang; Yu Shih ; et al. | 2019-05-30 |
| Contact Structure and Method of Fabricating the Same App 20180308761 - Hsu; Wan Hsuan ; et al. | 2018-10-25 |
| Electronic Device App 20180261957 - LI; Guang-Zong ; et al. | 2018-09-13 |
| Contact structure and method of fabricating the same Grant 10,037,918 - Hsu , et al. July 31, 2 | 2018-07-31 |
| Transfer Module And Electronic Device App 20180191094 - Wang; Yu-Shih ; et al. | 2018-07-05 |
| Electronic Device App 20180191116 - Wang; Yu-Shih ; et al. | 2018-07-05 |
| Contact Structure and Method of Fabricating the Same App 20180151560 - Hsu; Wan Hsuan ; et al. | 2018-05-31 |
| Electronic device Grant 9,952,641 - Wang , et al. April 24, 2 | 2018-04-24 |
| Transmission shaft set, transmission shaft structure and metal pin connecting shaft Grant 9,748,720 - Huang , et al. August 29, 2 | 2017-08-29 |
| Electronic assembly Grant 9,541,953 - Chen , et al. January 10, 2 | 2017-01-10 |
| Electronic assembly Grant 9,535,466 - Chang , et al. January 3, 2 | 2017-01-03 |
| Electronic Assembly App 20160306385 - Chen; Hsien-Wei ; et al. | 2016-10-20 |
| Dc Power Plug App 20160308319 - WANG; Yu-Shih ; et al. | 2016-10-20 |
| Electronic Assembly App 20160266616 - Chang; Yi-Mu ; et al. | 2016-09-15 |
| Transmission Shaft Set, Transmission Shaft Structure and Metal Pin Connecting Shaft App 20160104991 - Huang; Yi-Ta ; et al. | 2016-04-14 |
| Connector and the method for assembling Grant 9,105,992 - Wang , et al. August 11, 2 | 2015-08-11 |
| Electronic Peripheral And Electronic Device App 20150077914 - Huang; Yi-Ta ; et al. | 2015-03-19 |
| Connector And The Method For Assembling App 20140322928 - Wang; Yu-Shih ; et al. | 2014-10-30 |
| Integral structure including an antenna and a shielding cover and wireless module thereof Grant 6,937,205 - Chou , et al. August 30, 2 | 2005-08-30 |
| Integral structure including an antenna and a shielding cover and wireless module thereof App 20040135733 - Chou, Chen-Wang ; et al. | 2004-07-15 |
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