WANG; Youjun

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; Youjun.The latest application filed is for "video splitting method and electronic device".

Company Profile

1.9.8

WANG; Youjun - Shenzhen CN
Wang; Youjun - New Taipei TW
Wang; Youjun - New Taipei City TW
Wang; Youjun - Zhejiang CN
Wang; Youjun - Beijing CN
Wang; Youjun - Jiang Su Province CN
Wang; Youjun - Suzhou CN
Wang; Youjun - Jiangsu Province CN
Wang; Youjun - SuZhou Industrial Park CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Video Splitting Method And Electronic Device App 20220021950 - WEI; Wenbo ; et al.	2022-01-20
Test data integration system and method thereof Grant 11,120,037 - Yang , et al. September 14, 2	2021-09-14
Test Data Integration System And Method Thereof App 20200401596 - Yang; Yong ; et al.	2020-12-24
Mixer Grant D818,761 - Wang May 29, 2	2018-05-29
Mixer Grant D818,764 - Wang May 29, 2	2018-05-29
Electrosurgical pencil Grant D815,738 - Ye , et al. April 17, 2	2018-04-17
Method and device for processing geological information Grant 9,256,981 - Shu , et al. February 9, 2	2016-02-09
Method and Device for Processing Geological Information App 20140233809 - Shu; Bin ; et al.	2014-08-21
Packaging structure Grant 8,174,090 - Wang , et al. May 8, 2	2012-05-08
Optical Converter And Manufacturing Method Thereof And Light Emitting Diode App 20100171134 - Shao; Mingda ; et al.	2010-07-08
Packaging Method And Packaging Structure App 20100133640 - Wang; Zhiqi ; et al.	2010-06-03
Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same Grant 7,663,213 - Yu , et al. February 16, 2	2010-02-16
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same Grant 7,394,152 - Yu , et al. July 1, 2	2008-07-01
Wafer Level Chip Size Packaged Chip Device With A Double-Layer Lead Structure And Method Of Fabricating The Same App 20080111223 - Yu; Guoqing ; et al.	2008-05-15
Wafer Level Chip Size Packaged Chip Device With An N-Shape Junction Inside And Method Of Fabricating The Same App 20080111228 - Yu; Guoqing ; et al.	2008-05-15

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