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name:-0.0049629211425781
name:-0.0037260055541992
name:-0.0028660297393799
Wang; Yingchi Patent Filings

Wang; Yingchi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Yingchi.The latest application filed is for "array substrate and chip bonding method".

Company Profile
2.3.4
  • Wang; Yingchi - Wuhan CN
  • Wang; Yingchi - Hubei CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Array substrate and chip bonding method
Grant 11,101,230 - Guo , et al. August 24, 2
2021-08-24
Array Substrate And Chip Bonding Method
App 20210091027 - Guo; Chunpeng ;   et al.
2021-03-25
Cell test method and cell test device
Grant 10,354,567 - Xiong , et al. July 16, 2
2019-07-16
In-cell Touch Display
App 20190025966 - XING; Zhenzhou ;   et al.
2019-01-24
Cell Test Method And Cell Test Device
App 20180061289 - XIONG; Bin ;   et al.
2018-03-01
Method and device for performing gamma correction for LCD panels
Grant 9,892,671 - Xiong , et al. February 13, 2
2018-02-13
Method And Device For Performing Gamma Correction For Lcd Panels
App 20170140692 - XIONG; Bin ;   et al.
2017-05-18

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