Wang; Ying-Da

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Ying-Da.The latest application filed is for "sawing underfill in packaging processes".

Company Profile

5.10.12

Wang; Ying-Da - Taipei TW
Wang; Ying-Da - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Load cell array for detection of force input to an electronic device enclosure Grant 11,340,725 - Deng , et al. May 24, 2	2022-05-24
Sawing Underfill in Packaging Processes App 20210125964 - Lu; Szu-Wei ; et al.	2021-04-29
Sawing Underfill in Packaging Processes App 20210057383 - Lu; Szu-Wei ; et al.	2021-02-25
Load Cell Array for Detection of Force Input to an Electronic Device Enclosure App 20210004115 - Deng; Andrew ; et al.	2021-01-07
Sawing underfill in packaging processes Grant 10,840,215 - Lu , et al. November 17, 2	2020-11-17
Load cell array for detection of force input to an electronic device enclosure Grant 10,782,818 - Deng , et al. Sept	2020-09-22
Load Cell Array for Detection of Force Input to an Electronic Device Enclosure App 20200073504 - Deng; Andrew ; et al.	2020-03-05
Die-to-die gap control for semiconductor structure and method Grant 10,157,879 - Lin , et al. Dec	2018-12-18
Sawing Underfill in Packaging Processes App 20170213809 - Lu; Szu-Wei ; et al.	2017-07-27
Sawing underfill in packaging processes Grant 9,620,430 - Lu , et al. April 11, 2	2017-04-11
Die-to-Die Gap Control for Semiconductor Structure and Method App 20150125994 - Lin; Jing-Cheng ; et al.	2015-05-07
Die-to-die gap control for semiconductor structure and method Grant 8,963,334 - Lin , et al. February 24, 2	2015-02-24
Die structure and method of fabrication thereof Grant 8,828,848 - Lin , et al. September 9, 2	2014-09-09
Sawing Underfill in Packaging Processes App 20130187258 - Lu; Szu Wei ; et al.	2013-07-25
Die Structure and Method of Fabrication Thereof App 20130154062 - Lin; Jing-Cheng ; et al.	2013-06-20
Die-to-Die Gap Control for Semiconductor Structure and Method App 20130049216 - Lin; Jing-Cheng ; et al.	2013-02-28

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