WANG; Yih-Ching
Patent Applications and Registrations
Patent applications and USPTO patent grants for WANG; Yih-Ching.The latest application filed is for "interconnect structure and forming method thereof".
- WANG; Yih-Ching - Hsinchu TW
| Patent | Date |
|---|---|
| Interconnect Structure And Forming Method Thereof App 20220216165 - LIN; Jian-Hong ; et al. | 2022-07-07 |
| Method of fabricating semiconductor device including dummy via anchored to dummy metal layer Grant 11,302,654 - Lin , et al. April 12, 2 | 2022-04-12 |
| Method Of Fabricating Semiconductor Device App 20200411452 - LIN; Jian-Hong ; et al. | 2020-12-31 |
| Semiconductor device including dummy via anchored to dummy metal layer Grant 10,777,510 - Lin , et al. Sept | 2020-09-15 |
| Semiconductor Device And Method Of Fabrication Thereof App 20180151511 - Lin; Jian-Hong ; et al. | 2018-05-31 |
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