Wang; Yeng-Peng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Yeng-Peng.The latest application filed is for "semiconductor device having metal gate and manufacturing method thereof".

Company Profile

0.10.7

Wang; Yeng-Peng - Kaohsiung TW
Wang; Yeng-Peng - Kaohsiung County N/A TW
Wang; Yeng-Peng - Kaohsiung City TW
Wang; Yeng-Peng - Fongshan TW
Wang; Yeng-Peng - Fongshan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having metal gate and manufacturing method thereof Grant 8,999,830 - Liao , et al. April 7, 2	2015-04-07
Metal gate transistor and method for fabricating the same Grant 8,980,753 - Wang , et al. March 17, 2	2015-03-17
Semiconductor device having metal gate and manufacturing method thereof Grant 8,952,451 - Liao , et al. February 10, 2	2015-02-10
Semiconductor Device Having Metal Gate And Manufacturing Method Thereof App 20140127892 - Liao; Po-Jui ; et al.	2014-05-08
Semiconductor device having metal gate and manufacturing method thereof Grant 8,704,294 - Liao , et al. April 22, 2	2014-04-22
Semiconductor Device Having Metal Gate And Manufacturing Method Thereof App 20140103443 - Liao; Po-Jui ; et al.	2014-04-17
Method for forming metal gate Grant 8,551,847 - Wu , et al. October 8, 2	2013-10-08
Semiconductor Device Having Metal Gate And Manufacturing Method Thereof App 20120313178 - Liao; Po-Jui ; et al.	2012-12-13
Method of etching sacrificial layer Grant 8,298,950 - Yang , et al. October 30, 2	2012-10-30
Method For Forming Metal Gate App 20120244675 - Wu; Chun-Yuan ; et al.	2012-09-27
Metal Gate Transistor And Method For Fabricating The Same App 20120070995 - Wang; Yeng-Peng ; et al.	2012-03-22
Method Of Etching Sacrificial Layer App 20120003835 - YANG; Chan-Lon ; et al.	2012-01-05
Method of two-step backside etching Grant 7,759,252 - Wang July 20, 2	2010-07-20
Method of two-step backside etching App 20080280450 - Wang; Yeng-Peng	2008-11-13

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