Wang; Yen-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Yen-Ping.The latest application filed is for "semiconductor packages and forming methods thereof".

Company Profile

18.70.78

Wang; Yen-Ping - Hemei Township TW
Wang; Yen-Ping - Changhua County TW
Wang; Yen-Ping - New Taipei TW
WANG; Yen-Ping - New Taipei City TW
Wang; Yen-Ping - Changhua TW
Wang; Yen-Ping - Taipei TW
Wang; Yen-Ping - Taipei City TW
Wang; Yen-Ping - Taichung TW
Wang; Yen-Ping - Taichung Tsien TW
Wang; Yen-Ping - Hsin-Chu TW
Wang; Yen-Ping - Hsinchu TW
Wang; Yen-Ping - Hsin-Chu City TW
Wang; Yen-Ping - Hsinchu County TW
Wang; Yen-Ping - Taoyuan Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20220262765 - Yang; Ching-Jung ; et al.	2022-08-18
Semiconductor Packages And Forming Methods Thereof App 20220262734 - Wu; Kai-Chiang ; et al.	2022-08-18
Package structure and manufacturing method thereof Grant 11,417,616 - Wu , et al. August 16, 2	2022-08-16
Semiconductor packages and forming methods thereof Grant 11,348,874 - Wu , et al. May 31, 2	2022-05-31
Integrated Fan-out Package And Manufacturing Method Thereof App 20220157625 - Wu; Kai-Chiang ; et al.	2022-05-19
Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 11,329,022 - Yang , et al. May 10, 2	2022-05-10
Integrated fan-out package and manufacturing method thereof Grant 11,239,096 - Wu , et al. February 1, 2	2022-02-01
System of assessing performance of a photocuring light source for a printing machine and a combination having same Grant 11,225,098 - Chang , et al. January 18, 2	2022-01-18
Semiconductor Packages And Forming Methods Thereof App 20220013463 - Wu; Kai-Chiang ; et al.	2022-01-13
Semiconductor device Grant 11,211,339 - Wang , et al. December 28, 2	2021-12-28
Methods and Apparatus for Package with Interposers App 20210391230 - Lu; Chun-Lin ; et al.	2021-12-16
Methods and apparatus for package with interposers Grant 11,114,357 - Lu , et al. September 7, 2	2021-09-07
Surface mounting semiconductor components Grant 11,101,238 - Liu , et al. August 24, 2	2021-08-24
Semiconductor Device And Manufacturing Method Thereof App 20210210450 - LU; CHUN-LIN ; et al.	2021-07-08
Semiconductor Devices And Methods Of Manufacturing App 20210202266 - Chen; Chien-Hsun ; et al.	2021-07-01
System Of Assessing Performance Of A Photocuring Light Source For A Printing Machine And A Combination Having Same App 20210187985 - CHANG; Shih-Chang ; et al.	2021-06-24
Semiconductor Package And Manufacturing Method Thereof App 20210184335 - Wang; Yen-Ping ; et al.	2021-06-17
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface Grant 10,971,463 - Lu , et al. April 6, 2	2021-04-06
Method for singulating packaged integrated circuits and resulting structures Grant 10,964,595 - Wang , et al. March 30, 2	2021-03-30
Mechanisms for forming hybrid bonding structures with elongated bumps Grant 10,867,957 - Lu , et al. December 15, 2	2020-12-15
Integrated Fan-out Package And Manufacturing Method Thereof App 20200373173 - Wu; Kai-Chiang ; et al.	2020-11-26
Manufacturing Method Of A Semiconductor Device App 20200357659 - CHANG; SHOU ZEN ; et al.	2020-11-12
Package Structure And Manufacturing Method Thereof App 20200343203 - Wu; Kai-Chiang ; et al.	2020-10-29
Integrated fan-out package and manufacturing method thereof Grant 10,770,313 - Wu , et al. Sep	2020-09-08
Package structure and manufacturing method thereof Grant 10,748,861 - Wu , et al. A	2020-08-18
Semiconductor device and manufacturing method thereof Grant 10,727,082 - Chang , et al.	2020-07-28
Semiconductor Device App 20200111753 - WANG; CHUEI-TANG ; et al.	2020-04-09
Methods and Apparatus for Package with Interposers App 20200027803 - Lu; Chun-Lin ; et al.	2020-01-23
Methods and apparatus for package with interposers Grant 10,522,437 - Lu , et al. Dec	2019-12-31
Semiconductor device Grant 10,510,681 - Wang , et al. Dec	2019-12-17
Package Structure And Manufacturing Method Thereof App 20190355679 - Wu; Kai-Chiang ; et al.	2019-11-21
Method for Singulating Packaged Integrated Circuits and Resulting Structures App 20190244861 - Wang; Yen-Ping ; et al.	2019-08-08
Integrated Fan-out Package And Manufacturing Method Thereof App 20190244834 - Wu; Kai-Chiang ; et al.	2019-08-08
Manufacturing method of semiconductor package Grant 10,312,209 - Shih , et al.	2019-06-04
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20190157238 - Yang; Ching-Jung ; et al.	2019-05-23
Integrated fan-out package Grant 10,276,404 - Wu , et al.	2019-04-30
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps App 20190123017 - Lu; Chun-Lin ; et al.	2019-04-25
Method for singulating packaged integrated circuits and resulting structures Grant 10,269,640 - Wang , et al.	2019-04-23
Integrated circuit underfill scheme Grant 10,269,588 - Liang , et al.	2019-04-23
Integrated Fan-out Package App 20190067039 - Wu; Kai-Chiang ; et al.	2019-02-28
Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 10,170,444 - Yang , et al. J	2019-01-01
Package structure and method for manufacturing thereof Grant 10,163,854 - Wang , et al. Dec	2018-12-25
Mechanisms for forming hybrid bonding structures with elongated bumps Grant 10,163,846 - Lu , et al. Dec	2018-12-25
Semiconductor Device App 20180350752 - WANG; CHUEI-TANG ; et al.	2018-12-06
Methods and Apparatus for Package with Interposers App 20180240723 - Lu; Chun-Lin ; et al.	2018-08-23
Manufacturing Method Of Semiconductor Package App 20180233472 - SHIH; CHAO-WEN ; et al.	2018-08-16
Semiconductor device and manufacturing method thereof Grant 10,043,761 - Wang , et al. August 7, 2	2018-08-07
Semiconductor structure and manufacturing method thereof Grant 10,037,959 - Miao , et al. July 31, 2	2018-07-31
Surface Mounting Semiconductor Components App 20180211935 - LIU; MING-KAI ; et al.	2018-07-26
Methods and apparatus for package with interposers Grant 9,966,321 - Lu , et al. May 8, 2	2018-05-08
Semiconductor device and method of forming the same Grant 9,953,966 - Miao , et al. April 24, 2	2018-04-24
Semiconductor packaging and manufacturing method thereof Grant 9,953,942 - Shih , et al. April 24, 2	2018-04-24
Semiconductor chip scale package and manufacturing method thereof Grant 9,941,240 - Liu , et al. April 10, 2	2018-04-10
Package Structure And Method For Manufacturing Thereof App 20180061808 - WANG; Chuei-Tang ; et al.	2018-03-01
Semiconductor Device And Manufacturing Method Thereof App 20180061798 - LU; CHUN-LIN ; et al.	2018-03-01
Method for singulating packaged integrated circuits and resulting structures Grant 9,875,913 - Liu , et al. January 23, 2	2018-01-23
Package structure and method for manufacturing thereof Grant 9,818,722 - Wang , et al. November 14, 2	2017-11-14
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface Grant 9,806,045 - Lu , et al. October 31, 2	2017-10-31
Method for Singulating Packaged Integrated Circuits and Resulting Structures App 20170250114 - Wang; Yen-Ping ; et al.	2017-08-31
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps App 20170141073 - Lu; Chun-Lin ; et al.	2017-05-18
Method for singulating packaged integrated circuits and resulting structures Grant 9,653,417 - Wang , et al. May 16, 2	2017-05-16
Semiconductor Device And Manufacturing Method Thereof App 20170110412 - WANG; CHUEI-TANG ; et al.	2017-04-20
Package alignment structure and method of forming same Grant 9,627,325 - Liu , et al. April 18, 2	2017-04-18
Dimmable switching mode LED driving circuit without phase angle measurement Grant 9,596,729 - Huang , et al. March 14, 2	2017-03-14
Semiconductor Packaging And Manufacturing Method Thereof App 20170062369 - SHIH; CHAO-WEN ; et al.	2017-03-02
Semiconductor Device And Manufacturing Method Thereof App 20170062360 - CHANG; SHOU ZEN ; et al.	2017-03-02
Methods and Apparatus for Package with Interposers App 20170047261 - Lu; Chun-Lin ; et al.	2017-02-16
Mechanisms for forming hybrid bonding structures with elongated bumps Grant 9,559,071 - Lu , et al. January 31, 2	2017-01-31
Semiconductor Structure And Manufacturing Method Thereof App 20170018519 - MIAO; CHIA-CHUN ; et al.	2017-01-19
Semiconductor packaging and manufacturing method thereof Grant 9,543,263 - Shih , et al. January 10, 2	2017-01-10
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20170005067 - Yang; Ching-Jung ; et al.	2017-01-05
Methods and apparatus for package with interposers Grant 9,497,861 - Lu , et al. November 15, 2	2016-11-15
Semiconductor structure and manufacturing method thereof Grant 9,472,523 - Miao , et al. October 18, 2	2016-10-18
Integrated Circuit Underfill Scheme App 20160254169 - Liang; Shih-Wei ; et al.	2016-09-01
Semiconductor device having trench adjacent to receiving area and method of forming the same Grant 9,397,056 - Wang , et al. July 19, 2	2016-07-19
Integrated circuit underfill scheme Grant 9,355,924 - Liang , et al. May 31, 2	2016-05-31
Semiconductor Device And Method Of Forming The Same App 20160133618 - MIAO; CHIA-CHUN ; et al.	2016-05-12
Semiconductor device and method of manufacturing the same Grant 9,337,154 - Miao , et al. May 10, 2	2016-05-10
Semiconductor Device And Method Of Manufacturing The Same App 20160064338 - MIAO; CHIA-CHUN ; et al.	2016-03-03
Semiconductor device Grant 9,263,405 - Miao , et al. February 16, 2	2016-02-16
Semiconductor Device Having Trench Adjacent To Receiving Area And Method Of Forming The Same App 20150348923 - WANG; YEN-PING ; et al.	2015-12-03
Semiconductor device with bump adjustment and manufacturing method thereof Grant 9,184,143 - Miao , et al. November 10, 2	2015-11-10
Semiconductor Structure And Manufacturing Method Thereof App 20150200173 - MIAO; CHIA-CHUN ; et al.	2015-07-16
Singulated semiconductor structure Grant 9,064,873 - Miao , et al. June 23, 2	2015-06-23
Semiconductor Device And Method Of Forming The Same App 20150162291 - MIAO; CHIA-CHUN ; et al.	2015-06-11
Semiconductor Device And Method Of Forming The Same App 20150162288 - MIAO; CHIA-CHUN ; et al.	2015-06-11
Semiconductor Packaging And Manufacturing Method Thereof App 20150130020 - SHIH; CHAO-WEN ; et al.	2015-05-14
Method for Singulating Packaged Integrated Circuits and Resulting Structures App 20150125997 - Wang; Yen-Ping ; et al.	2015-05-07
Method for Singulating Packaged Integrated Circuits and Resulting Structures App 20150118797 - Liu; Ming-Kai ; et al.	2015-04-30
Semiconductor Device And Manufacturing Method Thereof App 20150061116 - LU; CHUN-LIN ; et al.	2015-03-05
Semiconductor Device And Manufacturing Method Thereof App 20150035161 - MIAO; CHIA-CHUN ; et al.	2015-02-05
Semiconductor Device And Manufacturing Method Thereof App 20150008575 - LIU; MING-KAI ; et al.	2015-01-08
Mechanisms For Forming Hybrid Bonding Structures With Elongated Bumps App 20150001704 - LU; Chun-Lin ; et al.	2015-01-01
Package Alignment Structure and Method of Forming Same App 20140252657 - Liu; Ming-Kai ; et al.	2014-09-11
Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same Grant 8,759,185 - Wang , et al. June 24, 2	2014-06-24
Methods and Apparatus for Package with Interposers App 20140160688 - Lu; Chun-Lin ; et al.	2014-06-12
Level Shifter Capable Of Pulse Filtering And Bridge Driver Using The Same App 20140125385 - Wang; Yen-Ping	2014-05-08
Integrated Circuit Underfill Scheme App 20140117555 - Liang; Shih-Wei ; et al.	2014-05-01
Level Shifter Capable Of Pulse Filtering And Bridge Driver Using The Same App 20140002140 - Wang; Yen-Ping	2014-01-02
Semiconductor device and fabrication method thereof Grant 8,603,911 - Huang , et al. December 10, 2	2013-12-10
Dc-dc Converter App 20130285626 - Chen; Yu-Jung ; et al.	2013-10-31
Pulse filter and bridge driver using the same Grant 8,564,363 - Wang October 22, 2	2013-10-22
Gas-discharge lamp controller utilizing a novel preheating phase control mechanism Grant 8,450,940 - Wang , et al. May 28, 2	2013-05-28
Package substrate having landless conductive traces Grant 8,304,665 - Chang , et al. November 6, 2	2012-11-06
Semiconductor Device And Fabrication Method Thereof App 20120223425 - Huang; Hui-Min ; et al.	2012-09-06
Gas-discharge lamp controller utilizing a novel reheating frequency generation mechanism Grant 8,217,583 - Wang , et al. July 10, 2	2012-07-10
Ultra-Shallow Junction MOSFET Having a High-k Gate Dielectric and In-Situ Doped Selective Epitaxy Source/Drain Extensions and a Method of Making Same App 20120083076 - Wang; Chih-Hao ; et al.	2012-04-05
Gas-discharge Lamp Controller Utilizing A Novel Reheating Frequency Generation Mechanism App 20120019159 - Wang; Yen-Ping ; et al.	2012-01-26
Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same Grant 8,097,924 - Wang , et al. January 17, 2	2012-01-17
Electronic ballast with dimming control from power line sensing Grant 8,067,904 - Lin , et al. November 29, 2	2011-11-29
Gas-discharge Lamp Controller Utilizing A Novel Preheating Phase Control Mechanism App 20110285322 - WANG; Yen-Ping ; et al.	2011-11-24
Monolithic inductor Grant 8,054,149 - Tung , et al. November 8, 2	2011-11-08
Single Chip Ballast Controller Capable Of Providing Brightness Levels Overview And Brightness Setting Of A Fluorescent Lamp App 20110199024 - Lin; Ko-Ming ; et al.	2011-08-18
Electronic ballast with dimming control from power line sensing Grant 7,999,495 - Lin , et al. August 16, 2	2011-08-16
Electronic ballast with dimming control from power line sensing Grant 7,999,494 - Lin , et al. August 16, 2	2011-08-16
Electronic ballast with dimming control from power line sensing Grant 7,982,413 - Lin , et al. July 19, 2	2011-07-19
Single Chip Ballast Controller For Step-dimming Of A Fluorescent Lamp App 20110169425 - Sha; Chang-Ling ; et al.	2011-07-14
Electronic Ballast With Dimming Control From Power Line Sensing App 20110012536 - Lin; Ko-Ming ; et al.	2011-01-20
Differential Type Level Shifter App 20110006828 - Chen; Pei-Yuan ; et al.	2011-01-13
Strained channel transistor formation Grant 7,867,860 - Huang , et al. January 11, 2	2011-01-11
Electronic Ballast With Dimming Control From Power Line Sensing App 20100277102 - LIN; Ko-Ming ; et al.	2010-11-04
Electronic Ballast With Dimming Control From Power Line Sensing App 20100277101 - LIN; Ko-Ming ; et al.	2010-11-04
Electronic Ballast With Dimming Control From Power Line Sensing App 20100277100 - Lin; Ko-Ming ; et al.	2010-11-04
Ultra shallow junction formation by solid phase diffusion Grant 7,727,845 - Wang , et al. June 1, 2	2010-06-01
Active-load Dominant Circuit For Common-mode Glitch Interference Cancellation App 20100123501 - Wang; Yen-Ping ; et al.	2010-05-20
Active-load dominant circuit for common-mode glitch interference cancellation Grant 7,719,325 - Wang , et al. May 18, 2	2010-05-18
Package Substrate Having Landless Conductive Traces App 20090283303 - Chang; Chiang-Cheng ; et al.	2009-11-19
PMOS transistor with discontinuous CESL and method of fabrication Grant 7,615,426 - Wang , et al. November 10, 2	2009-11-10
Partial replacement silicide gate Grant 7,498,641 - Wang , et al. March 3, 2	2009-03-03
Power inductor with heat dissipating structure Grant 7,429,907 - Tung , et al. September 30, 2	2008-09-30
Monolithic inductor App 20080157912 - Tung; Mean-Jue ; et al.	2008-07-03
Selective doping and thermal annealing method for forming a gate electrode pair with different work functions Grant 7,285,833 - Wang , et al. October 23, 2	2007-10-23
Power Inductor with Heat Dissipating Structure App 20070152792 - Tung; Mean-Jue ; et al.	2007-07-05
Ultra shallow junction formation by solid phase diffusion App 20070093033 - Wang; Chih-Hao ; et al.	2007-04-26
PMOS transistor with discontinuous CESL and method of fabrication App 20060189053 - Wang; Chih-Hao ; et al.	2006-08-24
Selective doping and thermal annealing method for forming a gate electrode pair with different work functions App 20060163661 - Wang; Yen Ping ; et al.	2006-07-27
Dual work function gate electrodes Grant 7,018,883 - Wang , et al. March 28, 2	2006-03-28
Partial replacement silicide gate App 20050263830 - Wang, Chih-Hao ; et al.	2005-12-01
Dual work function gate electrodes App 20050250271 - Wang, Chih-Hao ; et al.	2005-11-10
Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same App 20050093084 - Wang, Chih-Hao ; et al.	2005-05-05
Strained channel transistor formation App 20050082522 - Huang, Yi-Chun ; et al.	2005-04-21
Ferrite with high permeability and high dielectric constant and method for making the same Grant 6,569,346 - Tung , et al. May 27, 2	2003-05-27

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