Wang; Yen-Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Yen-Chih.The latest application filed is for "tool assembly".
- Wang; Yen-Chih - Hsinchu TW
- Wang; Yen Chih - Taoyuan City TW
| Patent | Date |
|---|---|
| Deposition processes for titanium nitride barrier and aluminum Grant 7,824,743 - Lee , et al. November 2, 2 | 2010-11-02 |
| Tool Assembly App 20100206139 - Wang; Yen Chih ; et al. | 2010-08-19 |
| Deposition Processes For Titanium Nitride Barrier And Aluminum App 20090087585 - LEE; WEI TI ; et al. | 2009-04-02 |
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