Wang; Ya Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Ya Ping.The latest application filed is for "transparent conductive electrode of touch panel".

Company Profile

2.8.10

Wang; Ya Ping - Shanghai CN
Wang; Ya Ping - Xiamen City CN
Wang; Ya Ping - Xiamen CN
Wang; Ya-Ping - Shanghai City CN
Wang; Ya-Ping - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip fabrication and packaging methods thereof Grant 11,335,648 - Lu , et al. May 17, 2	2022-05-17
Transparent Conductive Electrode Of Touch Panel App 20220137753 - Chuang; Chih Cheng ; et al.	2022-05-05
Transparent conductive electrode of touch panel Grant 11,320,951 - Chuang , et al. May 3, 2	2022-05-03
Fabrication method of packaging structure Grant 10,950,525 - Jin , et al. March 16, 2	2021-03-16
Semiconductor Chip Fabrication And Packaging Methods Thereof App 20200098704 - LU; Li Hui ; et al.	2020-03-26
Semiconductor chip, and fabrication and packaging methods thereof Grant 10,522,479 - Lu , et al. Dec	2019-12-31
Fabrication Method Of Packaging Structure App 20190393134 - JIN; Li Zhong ; et al.	2019-12-26
Packaging structure and fabrication method thereof Grant 10,446,474 - Jin , et al. Oc	2019-10-15
Semiconductor Chip, And Fabrication And Packaging Methods Thereof App 20180337143 - LU; Li Hui ; et al.	2018-11-22
Packaging Structure And Fabrication Method Thereof App 20180182690 - JIN; Li Zhong ; et al.	2018-06-28
Pick-up heads and systems for die bonding and related applications Grant 8,037,918 - Wang , et al. October 18, 2	2011-10-18
Integrated Circuit Package Stacking System With Lead Overlap And Method Of Manufacture Thereof App 20110248391 - Jin; Wei Qiang ; et al.	2011-10-13
Charger slipcover and handheld device Grant 8,035,336 - Wang , et al. October 11, 2	2011-10-11
Integrated circuit package system with support structure for die overhang Grant 7,989,941 - Chin , et al. August 2, 2	2011-08-02
Charger Slipcover and Handheld Device App 20100117589 - Wang; Ya-Ping ; et al.	2010-05-13
Position Deviation Adjustment Apparatus For Prosthesis App 20100036506 - Wang; Ya-Ping	2010-02-11
Integrated Circuit Package System With Support Structure For Die Overhang App 20090236751 - Chin; Chee Keong ; et al.	2009-09-24
Pick-up heads and systems for die bonding and related applications App 20080128081 - Wang; Ya Ping ; et al.	2008-06-05

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